Case molding capacitor having improved horizontal degree

    公开(公告)号:US11715601B2

    公开(公告)日:2023-08-01

    申请号:US17788981

    申请日:2021-06-29

    申请人: NUINTEK CO LTD

    IPC分类号: H01G4/224 H01G2/08

    CPC分类号: H01G4/224 H01G2/08

    摘要: The present disclosure relates to a case molding including: a plastic case having an accommodation chamber formed by four sides and a bottom to accommodate the capacitor module, and having an open side on the top for filling a molding agent; a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor, and an insulating sheet disposed between the first busbar and the second busbar; a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case, and then hardened therein; and a horizontal plate part positioned over the capacitor module and the filler, and has a horizontal plate integrated thereto with the bottom pressing the filler.

    Capacitor having insert injection-type case with dual material of metal and plastic

    公开(公告)号:US11935696B2

    公开(公告)日:2024-03-19

    申请号:US17788816

    申请日:2021-06-29

    申请人: NUINTEK CO LTD

    摘要: A capacitor includes a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device and having a first lead terminal on an exposed side, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor device and having a second lead terminal on an exposed side, and an insulating sheet disposed between the first busbar and the second busbar to insulate an overlap region; a plastic case having a 3D space formed by four sides and a bottom to accommodate the capacitor module and having an open top; a metallic external wall is formed outside one side of the four sides or the bottom of the plastic case; and a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case.