公开(公告)号：US11557491B2

公开(公告)日：2023-01-17

申请号：US16669579

申请日：2019-10-31

Applicant: NXP B.V.

Inventor： Leo van Gemert ,  Peter Joseph Hubert Drummen

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L23/66

Abstract: A method of forming an assembly is provided. The method includes attaching a packaged semiconductor device to a substrate. An isolation structure is formed and located between the packaged semiconductor device and the substrate. An underfill material is dispensed between the packaged semiconductor device and the substrate. The isolation structure prevents the underfill material from contacting a first conductive connection formed between the packaged semiconductor device and the substrate.

公开(公告)号：US20210134612A1

公开(公告)日：2021-05-06

申请号：US16669579

申请日：2019-10-31

Applicant: NXP B.V.

Inventor： Leo van Gemert ,  Peter Joseph Hubert Drummen

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/552 ,  H01L23/66 ,  H01L21/48

Abstract: A method of forming an assembly is provided. The method includes attaching a packaged semiconductor device to a substrate. An isolation structure is formed and located between the packaged semiconductor device and the substrate. An underfill material is dispensed between the packaged semiconductor device and the substrate. The isolation structure prevents the underfill material from contacting a first conductive connection formed between the packaged semiconductor device and the substrate.

公开(公告)号：US12183595B2

公开(公告)日：2024-12-31

申请号：US18064641

申请日：2022-12-12

Applicant: NXP B.V.

Inventor： Leo van Gemert ,  Peter Joseph Hubert Drummen

IPC: H01L23/552 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/66

Abstract: A method of forming an assembly is provided. The method includes attaching a packaged semiconductor device to a substrate. An isolation structure is formed and located between the packaged semiconductor device and the substrate. An underfill material is dispensed between the packaged semiconductor device and the substrate. The isolation structure prevents the underfill material from contacting a first conductive connection formed between the packaged semiconductor device and the substrate.

公开(公告)号：US10825789B1

公开(公告)日：2020-11-03

申请号：US16550549

申请日：2019-08-26

Applicant: NXP B.V.

Inventor： Leo Van Gemert ,  Adrianus Buijsman ,  Jeroen Johannes Maria Zaal ,  Michiel Van Soestbergen ,  Peter Joseph Hubert Drummen

IPC: H01L23/00

Abstract: One embodiment of a packaged semiconductor device includes: a redistributed layer (RDL) structure formed over an active side of a semiconductor die embedded in mold compound, the RDL structure includes a plurality of solder ball pads that in turn includes: a set of first solder ball pads located on a front side of the packaged semiconductor device within a footprint of the semiconductor die, and a set of second solder ball pads located on the front side of the packaged semiconductor device outside of the footprint of the semiconductor die, each first solder ball pad includes a first center portion having a first diameter measured between opposite outer edges of the first center portion, each second solder ball pad includes a second center portion having a second diameter measured between opposite outer edges of the second center portion, and the first diameter is smaller than the second diameter.