公开(公告)号：US20240347928A1

公开(公告)日：2024-10-17

申请号：US18600833

申请日：2024-03-11

Applicant: NXP B.V.

Inventor： Mustafa Acar ,  Zhiwei Gong ,  Robert Joseph Wenzel ,  Tingdong Zhou

IPC: H01Q21/06 ,  H01Q9/04 ,  H01Q21/00

CPC classification number: H01Q21/065 ,  H01Q9/0414 ,  H01Q21/0087

Abstract: An antenna package and method of manufacturing an antenna package is disclosed. The antenna package includes a first substrate and second substrate in a stacked arrangement. A first plurality of patch antennas and a plurality of decoupling capacitors is arranged on a first major surface of the first substrate. One or more decoupling capacitor of the plurality of decoupling capacitors is located between adjacent patch antennas of the first plurality of patch antennas. The second substrate includes a second plurality of patch antennas. One or more decoupling capacitors of the plurality of decoupling capacitors includes a first terminal configured to be in contact with the first substrate and a second terminal configured to be in contact with the first substrate and the second substrate.