公开(公告)号：US11787097B2

公开(公告)日：2023-10-17

申请号：US17173130

申请日：2021-02-10

Applicant: NXP USA, Inc.

Inventor： Sheila F. Chopin ,  Nishant Lakhera ,  Boon Yew Low

IPC: B29C48/27 ,  B29C48/39 ,  B29C48/375 ,  H01L21/56

CPC classification number: B29C48/271 ,  B29C48/388 ,  B29C48/39 ,  H01L21/565

Abstract: An encapsulant compound apparatus, includes a mechanical operator, and an insert disposed on a surface of the mechanical operator. The insert operates to capture foreign material in the encapsulant compound.

公开(公告)号：US11056457B2

公开(公告)日：2021-07-06

申请号：US16145203

申请日：2018-09-28

Applicant: NXP USA, INC.

Inventor： Boon Yew Low ,  Lan Chu Tan ,  Wai Yew Lo ,  Poh Leng Eu ,  Chin Teck Siong

IPC: H01L23/00 ,  H01L25/065 ,  H01L21/56 ,  H01L23/495

Abstract: A packaged semiconductor device includes a substrate having input/output (I/O) pads, a semiconductor die attached to the substrate and electrically connected to the substrate with bond wires. A bond-wire reinforcement structure is formed over the bond wires before the assembly is covered with a molding compound. The bond-wire reinforcement structure prevents wire sweep during molding and protects the wires from shorting with other wires. In one embodiment, the bond-wire reinforcement structure is formed with a fiberglass and liquid epoxy mixture.

公开(公告)号：US20230415397A1

公开(公告)日：2023-12-28

申请号：US18464409

申请日：2023-09-11

Applicant: NXP USA, INC.

Inventor： Sheila F. Chopin ,  Nishant Lakhera ,  Boon Yew Low

IPC: B29C48/27 ,  H01L21/56 ,  B29C48/39 ,  B29C48/375

CPC classification number: B29C48/271 ,  H01L21/565 ,  B29C48/39 ,  B29C48/388

Abstract: An encapsulant compound apparatus, includes a mechanical operator, and an insert disposed on a surface of the mechanical operator. The insert operates to capture foreign material in the encapsulant compound.

公开(公告)号：US20250126716A1

公开(公告)日：2025-04-17

申请号：US18486179

申请日：2023-10-13

Applicant: NXP USA, Inc.

Inventor： Boon Yew Low ,  Fui Yee Lim ,  Fernando A. Santos ,  Dominic (PohMeng) Koey

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/28

Abstract: A circuit module includes a module substrate with a mounting surface, and a plurality of conductive features and electronic circuitry coupled to the mounting surface. Encapsulant material covers the electronic circuitry and the mounting surface, and an upper surface of the encapsulant material defined a first surface of the circuit module. A plurality of leadframe terminals, each separated from a non-planar leadframe unit, extend from the conductive features at the mounting surface through the encapsulant material toward the first surface of the circuit module. Each of the leadframe terminals is formed from an elongated planar conductive feature of a leadframe unit, and the plurality of leadframe terminals is electrically coupled to the electronic circuitry through the conductive features and the module substrate. Encapsulant divots may extend into the encapsulant material from the first surface of the circuit module, and proximal ends of the leadframe terminals terminate at the encapsulant divots.

公开(公告)号：US11581241B2

公开(公告)日：2023-02-14

申请号：US17136408

申请日：2020-12-29

Applicant: NXP USA, Inc.

Inventor： Boon Yew Low ,  Fernando A. Santos ,  Li Li ,  Fui Yee Lim ,  Lan Chu Tan

IPC: H01L23/42 ,  H01L21/48 ,  H01L23/482

Abstract: A circuit module (e.g., an amplifier module) includes a module substrate, a thermal dissipation structure, a semiconductor die, encapsulant material, and an interposer. The module substrate has a mounting surface and a plurality of conductive pads at the mounting surface. The thermal dissipation structure extends through the module substrate, and a surface of the thermal dissipation structure is exposed at the mounting surface of the module substrate. The semiconductor die is coupled to the surface of the thermal dissipation structure. The encapsulant material covers the mounting surface of the module substrate and the semiconductor die, and a surface of the encapsulant material defines a contact surface of the circuit module. The interposer is embedded within the encapsulant material. The interposer includes a conductive terminal with a proximal end coupled to a conductive pad of the module substrate, and a distal end exposed at the contact surface of the circuit module.

公开(公告)号：US20220250301A1

公开(公告)日：2022-08-11

申请号：US17173130

申请日：2021-02-10

Applicant: NXP USA, Inc.

Inventor： Sheila F. Chopin ,  Nishant Lakhera ,  Boon Yew Low

IPC: B29C48/27 ,  B29C48/375 ,  B29C48/39 ,  H01L21/56

Abstract: An encapsulant compound apparatus, includes a mechanical operator, and an insert disposed on a surface of the mechanical operator. The insert operates to capture foreign material in the encapsulant compound.

公开(公告)号：US20220208646A1

公开(公告)日：2022-06-30

申请号：US17136408

申请日：2020-12-29

Applicant: NXP USA, Inc.

Inventor： Boon Yew Low ,  Fernando A. Santos ,  Li Li ,  Fui Yee Lim ,  Lan Chu Tan

IPC: H01L23/42 ,  H01L23/482 ,  H01L21/48

Abstract: A circuit module (e.g., an amplifier module) includes a module substrate, a thermal dissipation structure, a semiconductor die, encapsulant material, and an interposer. The module substrate has a mounting surface and a plurality of conductive pads at the mounting surface. The thermal dissipation structure extends through the module substrate, and a surface of the thermal dissipation structure is exposed at the mounting surface of the module substrate. The semiconductor die is coupled to the surface of the thermal dissipation structure. The encapsulant material covers the mounting surface of the module substrate and the semiconductor die, and a surface of the encapsulant material defines a contact surface of the circuit module. The interposer is embedded within the encapsulant material. The interposer includes a conductive terminal with a proximal end coupled to a conductive pad of the module substrate, and a distal end exposed at the contact surface of the circuit module.