公开(公告)号：US20110056737A1

公开(公告)日：2011-03-10

申请号：US12933263

申请日：2009-03-16

申请人： Naoto Hagiwara ,  Katsuei Ishida ,  Kazushi Yawata ,  Motoki Koyabashi

发明人： Naoto Hagiwara ,  Katsuei Ishida ,  Kazushi Yawata ,  Motoki Koyabashi

IPC分类号： H05K1/16

CPC分类号： H01G9/10 ,  H01G2/10 ,  H01G9/155 ,  H01M2/0202 ,  Y02E60/13

摘要： Provided is an electrochemical device compatible with high-temperature reflow soldering using a lead-free solder. An electrical double layer capacitor 10-1 includes a package 14 that is constructed with a film or films and has sealed parts 14a1 to 14a3 formed by sealing parts, in which films are superimposed on each other, by, for example, heat sealing. The entireties of the sealed parts 14a1 to 14a3 of the package 14 are covered in a close-contact state with a support 16 that has higher rigidity than the film(s) constructing the package 14.

摘要翻译： 提供与使用无铅焊料的高温回流焊接兼容的电化学装置。 电双层电容器10-1包括由膜或膜构成的封装件14，并且具有通过例如热封将膜彼此重叠的密封部分形成的密封部分14a1至14a3。 封装14的密封部分14a1至14a3的整体与具有比构成封装14的膜的刚性更高的刚性的支撑件16以紧密接触的状态被覆盖。