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公开(公告)号：US06783689B2
公开(公告)日：2004-08-31
申请号：US10145605
申请日：2002-05-10
IPC分类号： B41J204
CPC分类号： B41J2/164 , B41J2/14145 , B41J2/1603 , B41J2/1626 , B41J2/1631 , B41J2/1645 , B41J2002/14403 , Y10T29/49083 , Y10T29/49401
摘要： Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched through the thin film structure. At another step, material for an orifice layer is deposited into the pits. At another step, a firing chamber is etched into the orifice layer. At another step, a trench is etched into the backside of the wafer in the vicinity of the filled pits. The material filling each pit is not removed and remains in place to define the respective pillars. Two or more pillars are formed within the trench for each inkjet nozzle chamber. Alternatively pillars are formed by depositing material into the underside trench and performing photoimaging processes.
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公开(公告)号：US06309054B1
公开(公告)日：2001-10-30
申请号：US09178194
申请日：1998-10-23
IPC分类号： B41J205
CPC分类号： B41J2/164 , B41J2/14145 , B41J2/1603 , B41J2/1626 , B41J2/1631 , B41J2/1645 , B41J2002/14403 , Y10T29/49083 , Y10T29/49401
摘要： Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched through the thin film structure. At another step, material for an orifice layer is deposited into the pits. At another step, a firing chamber is etched into the orifice layer. At another step, a trench is etched into the backside of the wafer in the vicinity of the filled pits. The material filling each pit is not removed and remains in place to define the respective pillars. Two or more pillars are formed within the trench for each inkjet nozzle chamber. Alternatively pillars are formed by depositing material into the underside trench and performing photoimaging processes.
摘要翻译： 支柱形成在完全集成的热喷墨打印头中，以防止颗粒沿着墨水填充通道进入喷嘴室。 在将薄膜结构施加到基板上的步骤之后形成柱。 在一个步骤中，通过薄膜结构蚀刻凹坑。 在另一步骤中，用于孔层的材料沉积到凹坑中。 在另一步骤中，将烧制室蚀刻到孔口层中。 在另一步骤中，在填充的凹坑附近，在晶片的背面蚀刻沟槽。 填充每个坑的材料不被去除并保持在适当位置以限定相应的柱。 在每个喷墨喷嘴室的沟槽内形成两个或更多个柱。 或者，通过将材料沉积到下侧沟槽中并进行光成像工艺来形成柱。
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3.发明授权公开(公告)号：US07204933B2
公开(公告)日：2007-04-17
申请号：US11350998
申请日：2006-02-08
IPC分类号： B41J2/04
CPC分类号： B41J2/164 , B41J2/14145 , B41J2/1603 , B41J2/1626 , B41J2/1631 , B41J2/1645 , B41J2002/14403 , Y10T29/49083 , Y10T29/49401
摘要： Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched through the thin film structure. At another step, material for an orifice layer is deposited into the pits. At another step, a firing chamber is etched into the orifice layer. At another step, a trench is etched into the backside of the wafer in the vicinity of the filled pits. The material filling each pit is not removed and remains in place to define the respective pillars. Two or more pillars are formed within the trench for each inkjet nozzle chamber. Alternatively pillars are formed by depositing material into the underside trench and performing photoimaging processes.
摘要翻译： 支柱形成在完全集成的热喷墨打印头中，以防止颗粒沿着墨水填充通道进入喷嘴室。 在将薄膜结构施加到基板上的步骤之后形成柱。 在一个步骤中，通过薄膜结构蚀刻凹坑。 在另一步骤中，用于孔层的材料沉积到凹坑中。 在另一步骤中，将烧制室蚀刻到孔口层中。 在另一步骤中，在填充的凹坑附近，在晶片的背面蚀刻沟槽。 填充每个坑的材料不被去除并保持在适当位置以限定相应的柱。 在每个喷墨喷嘴室的沟槽内形成两个或更多个柱。 或者，通过将材料沉积到下侧沟槽中并进行光成像工艺来形成柱。
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公开(公告)号：US06660175B2
公开(公告)日：2003-12-09
申请号：US10235347
申请日：2002-09-04
IPC分类号： B41J204
CPC分类号： B41J2/164 , B41J2/14145 , B41J2/1603 , B41J2/1626 , B41J2/1631 , B41J2/1645 , B41J2002/14403 , Y10T29/49083 , Y10T29/49401
摘要： Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched through the thin film structure. At another step, material for an orifice layer is deposited into the pits. At another step, a firing chamber is etched into the orifice layer. At another step, a trench is etched into the backside of the wafer in the vicinity of the filled pits. The material filling each pit is not removed and remains in place to define the respective pillars. Two or more pillars are formed within the trench for each inkjet nozzle chamber. Alternatively pillars are formed by depositing material into the underside trench and performing photoimaging processes.
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5.发明授权公开(公告)号：US06905619B2
公开(公告)日：2005-06-14
申请号：US10144541
申请日：2002-05-10
CPC分类号： B41J2/164 , B41J2/14145 , B41J2/1603 , B41J2/1626 , B41J2/1631 , B41J2/1645 , B41J2002/14403 , Y10T29/49083 , Y10T29/49401
摘要： Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched through the thin film structure. At another step, material for an orifice layer is deposited into the pits. At another step, a firing chamber is etched into the orifice layer. At another step, a trench is etched into the backside of the wafer in the vicinity of the filled pits. The material filling each pit is not removed and remains in place to define the respective pillars. Two or more pillars are formed within the trench for each inkjet nozzle chamber. Alternatively pillars are formed by depositing material into the underside trench and performing photoimaging processes.
摘要翻译： 支柱形成在完全集成的热喷墨打印头中，以防止颗粒沿着墨水填充通道进入喷嘴室。 在将薄膜结构施加到基板上的步骤之后形成柱。 在一个步骤中，通过薄膜结构蚀刻凹坑。 在另一步骤中，用于孔层的材料沉积到凹坑中。 在另一步骤中，将烧制室蚀刻到孔口层中。 在另一步骤中，在填充的凹坑附近，在晶片的背面蚀刻沟槽。 填充每个坑的材料不被去除并保持在适当位置以限定相应的柱。 在每个喷墨喷嘴室的沟槽内形成两个或更多个柱。 或者，通过将材料沉积到下侧沟槽中并进行光成像工艺来形成柱。
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公开(公告)号：US06641744B1
公开(公告)日：2003-11-04
申请号：US09668627
申请日：2000-09-22
IPC分类号： B41J204
CPC分类号： B41J2/164 , B41J2/14145 , B41J2/1603 , B41J2/1626 , B41J2/1631 , B41J2/1645 , B41J2002/14403 , Y10T29/49083 , Y10T29/49401
摘要： Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched through the thin film structure. At another step, material for an orifice layer is deposited into the pits. At another step, a firing chamber is etched into the orifice layer. At another step, a trench is etched into the backside of the wafer in the vicinity of the filled pits. The material filling each pit is not removed and remains in place to define the respective pillars. Two or more pillars are formed within the trench for each inkjet nozzle chamber. Alternatively pillars are formed by depositing material into the underside trench and performing photoimaging processes.
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公开(公告)号：US07056444B2
公开(公告)日：2006-06-06
申请号：US10600285
申请日：2003-06-20
IPC分类号： B41J2/04
CPC分类号： B41J2/164 , B41J2/14145 , B41J2/1603 , B41J2/1626 , B41J2/1631 , B41J2/1645 , B41J2002/14403 , Y10T29/49083 , Y10T29/49401
摘要： Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched through the thin film structure. At another step, material for an orifice layer is deposited into the pits. At another step, a firing chamber is etched into the orifice layer. At another step, a trench is etched into the backside of the wafer in the vicinity of the filled pits. The material filling each pit is not removed and remains in place to define the respective pillars. Two or more pillars are formed within the trench for each inkjet nozzle chamber. Alternatively pillars are formed by depositing material into the underside trench and performing photoimaging processes.
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