DATA CENTER LIQUID CONDUCTION COOLING APPARATUS AND METHOD

    公开(公告)号:US20190343025A1

    公开(公告)日:2019-11-07

    申请号:US15972066

    申请日:2018-05-04

    IPC分类号: H05K7/20

    摘要: Embodiments disclosed include a heat exchange apparatus comprising an equipment-side coolant circuit configured for fluid communication with a first coolant compartment via a first coolant in-flow and out-flow valve. The embodiment further comprises a second coolant compartment operatively coupled to the first coolant compartment and comprising a second coolant in-flow and out-flow valve in fluid communication with a coolant supply source. The first coolant compartment is calibrated to receive hot coolant via the first coolant in-flow valve from a heat transfer element comprised in the equipment side coolant circuit line coupled to a heat generating source and in fluid communication with the first coolant in-flow valve, and the first coolant out-flow valve is calibrated to return the coolant to the heat transfer element comprised in the equipment side coolant circuit line. The second coolant compartment is calibrated to receive cold coolant from the coolant supply source via the second coolant in-flow valve and to return the received cold coolant to the coolant supply source via the second coolant out-flow valve in an open-loop coolant circuit line.

    Datacenter geothermal cooling system and method

    公开(公告)号:US11224145B2

    公开(公告)日:2022-01-11

    申请号:US16052273

    申请日:2018-08-01

    摘要: A cooling apparatus and method comprising a heat exchanger in thermal communication with a plurality of computing devices, a single or plurality of filtered coolant intake pipes and corresponding coolant exhaust pipes in thermal communication with the heat exchanger via a configurable filtration unit. The apparatus and method includes a geothermal heat sink comprised in a geothermal field, structured to transport heat away from the heat exchanger via the filtered coolant intake and exhaust pipes, and a coolant pump operatively coupled to the coolant intake and coolant exhaust pipes in a coolant circuit and configured to transport heat absorbed by the heat exchanger to the geological heat sink comprised in the geothermal field.

    DATACENTER GEOTHERMAL COOLING SYSTEM AND METHOD

    公开(公告)号:US20200045857A1

    公开(公告)日:2020-02-06

    申请号:US16052273

    申请日:2018-08-01

    摘要: A cooling apparatus and method comprising a heat exchanger in thermal communication with a plurality of computing devices, a single or plurality of filtered coolant intake pipes and corresponding coolant exhaust pipes in thermal communication with the heat exchanger via a configurable filtration unit. The apparatus and method includes a geothermal heat sink comprised in a geothermal field, structured to transport heat away from the heat exchanger via the filtered coolant intake and exhaust pipes, and a coolant pump operatively coupled to the coolant intake and coolant exhaust pipes in a coolant circuit and configured to transport heat absorbed by the heat exchanger to the geological heat sink comprised in the geothermal field.

    DATA CENTER RACK MOUNTED LIQUID CONDUCTION COOLING APPARATUS AND METHOD

    公开(公告)号:US20190150317A1

    公开(公告)日:2019-05-16

    申请号:US15810018

    申请日:2017-11-11

    IPC分类号: H05K7/20

    摘要: Embodiments disclosed include a liquid-cooled cooling apparatus comprising a cooling structure comprising a first heat transfer element mounted to the electronics rack, and in operative communication with a thermally conductive material comprising at least one coolant-carrying channel extending there through in a closed loop. The liquid-cooled cooling apparatus further comprises a second heat transfer element coupled to the first heat transfer element and in operative communication with a thermally conductive material comprising at least one coolant-carrying channel extending there through in at least one of an open loop and a closed loop. The apparatus optionally includes a plurality of heat transfer elements, each heat transfer element being coupled to one or more heat-generating components of a respective electronic system of a plurality of electronic systems, and wherein each heat transfer element provides a thermal transport path from the one or more heat-generating components of the respective electronic system.