公开(公告)号：US06975916B2

公开(公告)日：2005-12-13

申请号：US09900165

申请日：2001-07-09

Applicant: Neal Kuo

Inventor： Neal Kuo

IPC: G06Q10/00 ,  G06F19/00

CPC classification number: G06Q10/04

Abstract: A computer-implemented method for identifying the best process path in a semiconductor manufacturing process for processing a plurality of wafer lots that includes providing a plurality of operations in the semiconductor manufacturing process, providing a plurality of tools in at least one of the plurality of operations, providing a plurality of yields for each of the plurality of operations, providing a plurality of process paths, calculating an average yield for the plurality of yields, setting the average yield as a response, setting the plurality of operations as control factors, setting the plurality of tools as factor levels in response to at least one of the plurality of operations, determining at least one of the plurality of operations as having the most contribution using an analysis of variance method, wherein the at least one of the plurality of operations causes the responses to change greater than a predetermined level when the plurality of tools are changed, and outputting the at least one of the plurality of operations as the most influential operation.

Abstract translation: 一种用于识别用于处理多个晶片批次的半导体制造工艺中的最佳工艺路径的计算机实现的方法，其包括在所述半导体制造工艺中提供多个操作，在所述多个操作中的至少一个中提供多个工具 为多个操作中的每个操作提供多个产量，提供多个处理路径，计算多个产量的平均收益率，将平均收益率设置为响应，将多个操作设置为控制因素，将 多个工具作为响应于所述多个操作中的至少一个操作的因子级别，使用方差分析方法将所述多个操作中的至少一个确定为具有最多贡献，其中所述多个操作中的至少一个导致 当多个工具改变时响应变化大于预定水平，并且输出 将所述多个操作中的至少一个作为最有影响力的操作。