公开(公告)号：US20180179050A1

公开(公告)日：2018-06-28

申请号：US15904631

申请日：2018-02-26

Applicant: NextInput, Inc.

Inventor： Amnon Brosh ,  Ryan Diestelhorst ,  Steven Nasiri

IPC: B81B3/00 ,  G01L1/18 ,  G01L1/20 ,  B81C1/00

CPC classification number: B81B3/0056 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81C1/00626 ,  G01L1/18 ,  G01L1/205 ,  G01L9/0047 ,  G01L9/0048

Abstract: Described herein is a miniaturized and ruggedized wafer level MEMS force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges.

公开(公告)号：US20160332866A1

公开(公告)日：2016-11-17

申请号：US15111044

申请日：2015-01-13

Applicant: NextInput, Inc.

Inventor： Amnon Brosh ,  Ryan Diestelhorst ,  Steven Nasiri

IPC: B81B3/00

CPC classification number: B81B3/0056 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81C1/00626 ,  G01L1/18 ,  G01L1/205 ,  G01L9/0047 ,  G01L9/0048

Abstract: Described herein is a miniaturized and ruggedized wafer level MEMS force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges.

Abstract translation: 这里描述的是由基座和盖组成的小型化和加固的晶片级MEMS力传感器。 传感器采用多个柔性膜，机械过载停止，挡土墙和压阻应变计。

公开(公告)号：US20200024126A1

公开(公告)日：2020-01-23

申请号：US16254968

申请日：2019-01-23

Applicant: NextInput, Inc.

Inventor： Amnon Brosh ,  Ryan Diestelhorst ,  Steven Nasiri

IPC: B81B3/00 ,  G01L1/18 ,  B81C1/00 ,  G01L1/20

Abstract: Described herein is a miniaturized and ruggedized wafer level MEMS force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges.

公开(公告)号：US09902611B2

公开(公告)日：2018-02-27

申请号：US15111044

申请日：2015-01-13

Applicant: NextInput, Inc.

Inventor： Amnon Brosh ,  Ryan Diestelhorst ,  Steven Nasiri

IPC: B81B3/00 ,  B81C1/00 ,  G01L1/18 ,  G01L1/20

CPC classification number: B81B3/0056 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81C1/00626 ,  G01L1/18 ,  G01L1/205 ,  G01L9/0047 ,  G01L9/0048

Abstract: Described herein is a miniaturized and ruggedized wafer level MEMS force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges.