公开(公告)号：US20230247792A1

公开(公告)日：2023-08-03

申请号：US18100581

申请日：2023-01-24

Applicant: Nidec Corporation

Inventor： Yoshimasa KITAMURA ,  Naoyuki TAKASHIMA ,  Takehito TAMAOKA ,  Toshihiko TOKESHI

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20254

Abstract: A cooling device includes a first cooling section, a second cooling section, a first pump section, a second pump section, a branch section, a first flow path section, a second flow path section, a merging section, and a connection section. The branch section branches a refrigerant into two. The first flow path section connects the first cooling section and the first pump section, and one portion of the refrigerant passes through the first flow path section. The second flow path section connects the second cooling section and the second pump section, and another portion of the refrigerant passes through the second flow path section. The merging section merges the refrigerant having passed through each of the first flow path section and the second flow path section. The connection section connects the first and second flow path sections between the branch section and the merging section.