公开(公告)号：US11758253B2

公开(公告)日：2023-09-12

申请号：US17043381

申请日：2019-04-12

申请人： Ningbo Sunny Opotech Co., Ltd.

发明人： Bojie Zhao ,  Dongli Yuan ,  Zhen Huang ,  QiMin Mei ,  Zhenyu Chen

IPC分类号： H04N23/54 ,  H04N23/51 ,  H04N23/55 ,  H04N23/57 ,  G03B17/02

CPC分类号： H04N23/54 ,  G03B17/02 ,  H04N23/51 ,  H04N23/55 ,  H04N23/57

摘要： This invention provides a camera module having a chamfer, a photosensitive assembly, a preparation method, and an electronic device. The photosensitive assembly of the camera module having the chamfer includes: a photosensitive element; a circuit board, wherein the photosensitive element is electrically connected and attached to the circuit board, and wherein the circuit board has a circuit board chamfer; and a molded body having a light window and a molded body chamfer, wherein the molded body chamfer and the circuit board chamfer are correspondingly arranged to form a chamfer portion suitable for forming a chamfer structure of the camera module, and wherein the molded body is molded on the circuit board and encapsulates the photosensitive element, so that the camera module may be installed at a corner of the electronic device, thereby increasing the screen-to-body ratio.