公开(公告)号：US08222964B2

公开(公告)日：2012-07-17

申请号：US12164442

申请日：2008-06-30

申请人： Noam Avni ,  Amit Zeevi ,  Yavir Navot ,  Motti Haller

发明人： Noam Avni ,  Amit Zeevi ,  Yavir Navot ,  Motti Haller

IPC分类号： H03B5/32

CPC分类号： H01L25/16 ,  H01L23/49816 ,  H01L2224/48091 ,  H01L2924/00014

摘要： In some embodiments, an apparatus and system includes a substrate including outer surfaces, one of the outer surfaces defining a first plurality of electrical contacts, one of the outer surfaces adapted to be mounted to a circuit board and defining a second plurality of electrical contacts adapted to be electrically connected to the circuit board; an integrated circuit die mounted to one of the outer surfaces, and a crystal oscillator mounted to one of the outer surfaces and electrically connected to the integrated circuit die. In some embodiments, a method includes providing a substrate including outer surfaces, one of the outer surfaces defining a first plurality of electrical contacts, one of the outer surfaces adapted to be mounted to a circuit board and defining a second plurality of electrical contacts adapted to be electrically connected to the circuit board; mounting an integrated circuit die to one of the outer surfaces, mounting a crystal oscillator to one of the outer surfaces; and electrically connecting the crystal oscillator to the integrated circuit die.

摘要翻译： 在一些实施例中，装置和系统包括包括外表面的基板，外表面中的一个限定第一多个电触点，外表面中的一个适于安装到电路板并且限定第二多个电触点， 电连接到电路板; 安装到外表面中的一个的集成电路管芯，以及安装到外表面之一并电连接到集成电路管芯的晶体振荡器。 在一些实施例中，一种方法包括提供包括外表面的基板，其中一个外表面限定第一多个电触点，外表面中的一个适于安装到电路板并且限定第二多个电触头， 电连接到电路板; 将集成电路管芯安装到其中一个外表面上，将晶体振荡器安装到外表面之一; 并将晶体振荡器电连接到集成电路管芯。

公开(公告)号：US20090322437A1

公开(公告)日：2009-12-31

申请号：US12164442

申请日：2008-06-30

申请人： Noam Avni ,  Amit Zeevi ,  Yavir Navot ,  Motti Haller

发明人： Noam Avni ,  Amit Zeevi ,  Yavir Navot ,  Motti Haller

IPC分类号： H03B5/32 ,  H01L21/50

CPC分类号： H01L25/16 ,  H01L23/49816 ,  H01L2224/48091 ,  H01L2924/00014

摘要： In some embodiments, an apparatus and system includes a substrate including outer surfaces, one of the outer surfaces defining a first plurality of electrical contacts, one of the outer surfaces adapted to be mounted to a circuit board and defining a second plurality of electrical contacts adapted to be electrically connected to the circuit board; an integrated circuit die mounted to one of the outer surfaces, and a crystal oscillator mounted to one of the outer surfaces and electrically connected to the integrated circuit die. In some embodiments, a method includes providing a substrate including outer surfaces, one of the outer surfaces defining a first plurality of electrical contacts, one of the outer surfaces adapted to be mounted to a circuit board and defining a second plurality of electrical contacts adapted to be electrically connected to the circuit board; mounting an integrated circuit die to one of the outer surfaces, mounting a crystal oscillator to one of the outer surfaces; and electrically connecting the crystal oscillator to the integrated circuit die.

摘要翻译： 在一些实施例中，装置和系统包括包括外表面的基板，外表面中的一个限定第一多个电触点，外表面中的一个适于安装到电路板并且限定第二多个电触点， 电连接到电路板; 安装到外表面中的一个的集成电路管芯，以及安装到外表面之一并电连接到集成电路管芯的晶体振荡器。 在一些实施例中，一种方法包括提供包括外表面的基板，其中一个外表面限定第一多个电触点，外表面中的一个适于安装到电路板并且限定第二多个电触头， 电连接到电路板; 将集成电路管芯安装到其中一个外表面上，将晶体振荡器安装到外表面之一; 并将晶体振荡器电连接到集成电路管芯。