Photocurable resin composition for the preparation of a printed wiring
board and process for the preparation of photocurable resin
    1.
    发明授权
    Photocurable resin composition for the preparation of a printed wiring board and process for the preparation of photocurable resin 失效
    用于制备印刷线路板的光固化树脂组合物和用于制备光固化树脂的方法

    公开(公告)号:US5523383A

    公开(公告)日:1996-06-04

    申请号:US240906

    申请日:1994-05-11

    摘要: A process for the preparation of a photocurable resin which comprises the steps of(I) (a) imidating 20 to 80 mole % of the acid arthydride groups present in an adduct prepared by the addition reaction of an .alpha.,.beta.-unsaturated dicarboxylic acid arthydride to a conjugated diene polymer or copolymer with a primary amine to produce water and an amide,(b) reacting the thus formed water as a by-product with at least a part of the remaining acid arthydride groups in said adduct to produce the succinic acid groups by opening the ring of said acid arthydride groups,(II) dehydrating the thus produced succinic acid groups by heating to cause ring closure again thereby forming acid anhydride groups and(III) reacting at least a part, preferably at least 50 mole %, of the acid anhydride rings present in the polymer with an .alpha.,.beta.-unsaturated monocarboxylic acid ester having an alcoholic hydroxyl group to conduct a half-esterification by opening the ring of said acid arthydride groups.

    摘要翻译: 一种制备可光固化树脂的方法,其包括以下步骤:(a)(a)酰胺化20-80%(摩尔)存在于通过α,β-不饱和二羧酸亚硫酸酯加成反应制备的加合物中的酸性亚硫酸酯基 与伯胺反应生成水和酰胺的共轭二烯聚合物或共聚物,(b)将如此形成的水作为副产物与所述加合物中剩余的酸亚硫酸酯基团的至少一部分反应,生成琥珀酸 通过打开所述酸性亚硫酸酯基团的环,(II)通过加热使由此产生的琥珀酸基团脱水以再次引起闭环,从而形成酸酐基团,和(III)使至少一部分,优选至少50摩尔% 的存在于聚合物中的酸酐环与具有醇羟基的α,β-不饱和一元羧酸酯进行半酯化,通过打开所述酸亚硫酸氢盐环的环 ps。