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公开(公告)号：US20250056708A1
公开(公告)日：2025-02-13
申请号：US18447480
申请日：2023-08-10
Applicant: Nokia Solutions and Networks Oy
Inventor： Cristian Bolle , Mark Earnshaw
IPC: H05K1/02
Abstract: An optical module includes a PCB having an electronic component mounted on a first side thereof. A heat sink is located along a second side of the PCB. A thermoelectric cooler (TEC) is disposed in an opening through the PCB and has a surface adjacent the heat sink. A laser is located at another surface of the TEC in a thermal contact therewith. An optical fiber mount is attached to the first side of the PCB to hold an optical fiber end in optical alignment with the laser.
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