公开(公告)号：US20010023055A1

公开(公告)日：2001-09-20

申请号：US09861711

申请日：2001-05-22

申请人： Noritake Co., Ltd. and Kyushu Noritake Co., Ltd.

发明人： Susumu Sakamoto ,  Hiroshi Oshima ,  Hiroyuki Mori ,  Hironobu Ichihara ,  Yoji Sato

IPC分类号： F27B009/12 ,  A21B001/04

CPC分类号： C03C17/002 ,  H05K1/0306 ,  H05K3/022

摘要： Firing process and apparatus for uniformly heat-treating a substrate having a film-forming composition thereon, wherein the substrate is subjected to a first soaking step in which the substrate is held for a predetermined time in a first heating chamber whose temperature is maintained at a first value, so that the temperature within the substrate is held at the first value evenly throughout an entire mass of the substrate, and after feeding of the substrate into a second heating chamber whose temperature is maintained at a predetermined second value which is different from the first value by a predetermined difference, the substrate is subjected to a second soaking step in which the substrate is held for a second predetermined time in the second heating chamber, so that the temperature within the substrate is held at the second value evenly throughout the entire mass of the substrate.