公开(公告)号：US20080116921A1

公开(公告)日：2008-05-22

申请号：US11551735

申请日：2006-10-23

申请人： Normand Cote ,  Peter J. Demko ,  David L. Gardell ,  Jeffrey D. Gelorme ,  Marco D. Knox ,  George J. Lawson ,  Kathryn C. Rivera

发明人： Normand Cote ,  Peter J. Demko ,  David L. Gardell ,  Jeffrey D. Gelorme ,  Marco D. Knox ,  George J. Lawson ,  Kathryn C. Rivera

IPC分类号： G01R31/02

CPC分类号： G01R31/2877

摘要： A heat sink for use in the burn-in of an I/C chip, which chip has a generally “flat” surface. The heat sink has a “flat” surface with micro-channels therein, positioned to open and close in and out of contact against the flat surface of an I/C chip being burned-in. At least one liquid opening communicates with said essentially flat surface on the heat sink to continuously apply liquid between the heat sink and the chip. A liquid inlet is provided to supply liquid to said at least one liquid opening. A recovery channel is positioned to recover liquid from between the heat sink and the chip, and an exhaust member is provided to carry liquid from said recovery channel to the exterior of the heat sink. The invention also includes a method of burning-in a chip.

摘要翻译： 用于I / C芯片老化的散热器，该芯片具有通常“平坦”的表面。 散热器具有在其中具有微通道的“平坦”表面，定位成打开和关闭与被烧入的I / C芯片的平坦表面的接触和接触。 至少一个液体开口与散热器上的所述基本平坦的表面连通，以在散热器和芯片之间连续地施加液体。 提供液体入口以将液体供应到所述至少一个液体开口。 定位回收通道以从散热器和芯片之间回收液体，并且提供排气构件以将液体从所述回收通道运送到散热器的外部。 本发明还包括一种烧入芯片的方法。