公开(公告)号：US20240194509A1

公开(公告)日：2024-06-13

申请号：US18583621

申请日：2024-02-21

Applicant: OKINS ELECTRONICS CO., LTD

Inventor： Jin Kook JUN ,  Sung Gye PARK ,  Soung Hun CHOI

IPC: H01L21/677 ,  H01F7/02

CPC classification number: H01L21/67721 ,  H01F7/0252

Abstract: Provided is a magnetic collet. The magnetic collet includes adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof, and a metal plate including a common hole which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes and stacked on the adsorption rubber.

公开(公告)号：US20210233789A1

公开(公告)日：2021-07-29

申请号：US17154253

申请日：2021-01-21

Applicant: OKINS ELECTRONICS CO., LTD

Inventor： Jin Kook JUN ,  Sung Gye PARK ,  Soung Hun CHOI

IPC: H01L21/677 ,  H01F7/02

Abstract: Provided is a magnetic collet. The magnetic collet includes adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof, and a metal plate including a common hole which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes and stacked on the adsorption rubber.

公开(公告)号：US20230395413A1

公开(公告)日：2023-12-07

申请号：US18452271

申请日：2023-08-18

Applicant: OKINS ELECTRONICS CO., LTD

Inventor： Jin Kook JUN ,  Sung Gye PARK ,  Soung Hun CHOI

IPC: H01L21/677 ,  H01F7/02

CPC classification number: H01L21/67721 ,  H01F7/0252

Abstract: Provided is a magnetic collet. The magnetic collet includes adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof, and a metal plate including a common hole which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes and stacked on the adsorption rubber.