-
公开(公告)号:US12211722B2
公开(公告)日:2025-01-28
申请号:US18583621
申请日:2024-02-21
Applicant: OKINS ELECTRONICS CO., LTD
Inventor: Jin Kook Jun , Sung Gye Park , Soung Hun Choi
IPC: H01L21/677 , H01F7/02
Abstract: Provided is a magnetic collet. The magnetic collet includes adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof, and a metal plate including a common hole which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes and stacked on the adsorption rubber.
-
公开(公告)号:US12100607B2
公开(公告)日:2024-09-24
申请号:US18452271
申请日:2023-08-18
Applicant: OKINS ELECTRONICS CO., LTD
Inventor: Jin Kook Jun , Sung Gye Park , Soung Hun Choi
IPC: H01L21/677 , H01F7/02
CPC classification number: H01L21/67721 , H01F7/0252
Abstract: Provided is a magnetic collet. The magnetic collet includes adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof, and a metal plate including a common hole which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes and stacked on the adsorption rubber.
-