公开(公告)号：US10153453B2

公开(公告)日：2018-12-11

申请号：US15032879

申请日：2014-11-26

Applicant: OSRAM OLED GmbH

Inventor： Egbert Höfling ,  Simon Schicktanz

IPC: H01L51/52 ,  H01L51/00

Abstract: An electronic component includes a connection carrier having a cover surface, a first electric connection point and a second electric connection point, and an organic active area. A first electrode interconnects in an electrically conductive manner the active area and the first electric connection point. An encapsulation layer protects the active area against humidity and atmospheric gases. The electronic component can be contacted from the outside by the electric connection points and the encapsulation layer is in direct contact, in places, with the connection carrier.

公开(公告)号：US20160285031A1

公开(公告)日：2016-09-29

申请号：US15032879

申请日：2014-11-26

Applicant: OSRAM OLED GMBH

Inventor： Egbert Höfling ,  Simon Schicktanz

IPC: H01L51/52 ,  H01L51/00

CPC classification number: H01L51/5203 ,  H01L51/0096 ,  H01L51/5253 ,  H01L2251/5315 ,  H01L2251/5361 ,  Y02E10/549 ,  Y02P70/521

Abstract: An electronic component includes a connection carrier having a cover surface, a first electric connection point and a second electric connection point, and an organic active area. A first electrode interconnects in an electrically conductive manner the active area and the first electric connection point. An encapsulation layer protects the active area against humidity and atmospheric gases. The electronic component can be contacted from the outside by the electric connection points and the encapsulation layer is in direct contact, in places, with the connection carrier.

Abstract translation: 电子部件包括具有盖表面，第一电连接点和第二电连接点以及有机有源区的连接载体。 第一电极以导电方式互连有源区和第一电连接点。 封装层保护有源区域免受湿度和大气气体的影响。 电子部件可以通过电连接点从外部接触，并且封装层与连接托架直接接触。