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1.发明授权公开(公告)号：US10693088B2
公开(公告)日：2020-06-23
申请号：US15786643
申请日：2017-10-18
Applicant: OSRAM OLED GmbH
Inventor： Sebastian Wittmann , Arne Fleissner , Erwin Lang , Nina Riegel
Abstract: In various embodiments, a method for producing an optoelectronic device is provided. The method may include in the following order: providing a substrate, having a first state having a non-planar shape, reshaping the substrate into a second state. The second state has a planar or substantially planar shape. The method may further include forming at least one optoelectronic component on the substrate and reshaping the substrate into a third state. The third state is identical or substantially identical to the first state.
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公开(公告)号：US10312460B2
公开(公告)日：2019-06-04
申请号：US15618233
申请日：2017-06-09
Applicant: OSRAM OLED GmbH
Inventor： Daniel Riedel , Nina Riegel , Thomas Wehlus , Arne Fleißner , Armin Heinrichsdobler , Sebastian Wittmann
Abstract: An optoelectronic device includes a flexible organic light-emitting diode having a main extension plane, a first retaining element having a first major surface formed in accordance with a bent surface, and a second retaining element, wherein the OLED is arranged between the first retaining element and the second retaining element, and the OLED is mechanically fixed by the first retaining element and/or the second retaining element such that the main extension plane of the OLED is formed in accordance with the bent surface.
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公开(公告)号：US20190081278A1
公开(公告)日：2019-03-14
申请号：US15768523
申请日：2017-03-29
Applicant: OSRAM OLED GmbH
Inventor： Sebastian Wittmann , Arne Fleißner , Erwin Lang
Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment the multilayer encapsulation includes a layer sequence having at least one barrier layer and at least one planarization layer. The barrier layer and the planarization layer together have a lower water permeability than the barrier layer.
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4.发明申请公开(公告)号：US20200266370A1
公开(公告)日：2020-08-20
申请号：US16868566
申请日：2020-05-07
Applicant: OSRAM OLED GmbH
Inventor： Sebastian Wittmann , Arne Fleissner , Erwin Lang , Nina Riegel
Abstract: In various aspects, an optoelectronic device is provided. The device may include a first substrate having a first non-planar shape, wherein the first substrate comprises a first shape memory material, a second substrate having a second non-planar shape, wherein the second substrate comprises a second shape memory material, and at least one optoelectronic component, arranged between the first substrate and the second substrate, wherein the first substrate is arranged in a coplanar or substantially coplanar manner with respect to the second substrate.
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公开(公告)号：US20200212343A1
公开(公告)日：2020-07-02
申请号：US16813922
申请日：2020-03-10
Applicant: OSRAM OLED GmbH
Inventor： Erwin Lang , Thomas Wehlus , Arne Fleißner , Sebastian Wittmann
IPC: H01L51/52
Abstract: A component module includes a component holder having a curved upper side, and a radiation-emitting component arranged in a curved shape on the upper side, wherein the component holder includes a heat-distributing region on the upper side, a neutral fiber running inside the component, an adhesive is planar and arranged between the radiation-emitting component and the upper side, and the adhesive fixes the radiation-emitting component on the upper side.
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Patent Agency Ranking
公开(公告)号：US20180151833A1
公开(公告)日：2018-05-31
申请号：US15823643
申请日：2017-11-28
Applicant: OSRAM OLED GmbH
Inventor： Nina Riegel , Sebastian Wittmann , Erwin Lang , Arne Fleissner
CPC classification number: H01L51/5237 , H01L51/0097 , H01L51/5253 , H01L51/5268 , H01L51/56
Abstract: In various embodiments, an optoelectronic component is provided. The optoelectronic component includes an optically active layer structure on a surface of a planar substrate. The surface in a predefined region is free of optically active layer structure. The optoelectronic component further includes an encapsulation structure having an inorganic encapsulation layer. The inorganic encapsulation layer is formed on or above the optically active layer structure and the surface of the substrate in the predefined region. The inorganic encapsulation layer at least in the predefined region is formed in direct contact with the surface of the substrate. The surface of the substrate at least in the predefined region includes a structuring. The structuring is configured to increase the roughness of the surface. The substrate at least in the predefined region at the surface thereof includes or is formed from an inorganic material.
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7.发明申请公开(公告)号：US20180106436A1
公开(公告)日：2018-04-19
申请号：US15786643
申请日：2017-10-18
Applicant: OSRAM OLED GmbH
Inventor： Sebastian Wittmann , Arne Fleissner , Erwin Lang , Nina Riegel
IPC: F21K9/90
CPC classification number: H01L51/0097 , H01L51/5209 , H01L51/5225 , H01L51/5246 , H01L51/5253 , H01L51/56 , H01L2251/5338 , H01L2251/5361 , H01L2251/56
Abstract: In various embodiments, a method for producing an optoelectronic device is provided. The method may include in the following order: providing a substrate, having a first state having a non-planar shape, reshaping the substrate into a second state. The second state has a planar or substantially planar shape. The method may further include forming at least one optoelectronic component on the substrate and reshaping the substrate into a third state. The third state is identical or substantially identical to the first state.
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公开(公告)号：US20170244053A1
公开(公告)日：2017-08-24
申请号：US15421859
申请日：2017-02-01
Applicant: OSRAM OLED GmbH
Inventor： Sebastian Wittmann , Arne Fleissner , Erwin Lang
CPC classification number: H01L51/0097 , H01L51/0003 , H01L51/0011 , H01L51/5056 , H01L51/5072 , H01L51/52 , H01L51/5206 , H01L51/5209 , H01L51/5221 , H01L51/5225 , H01L51/5253 , H01L51/56 , H01L2251/5338 , H01L2251/5392 , H01L2251/558
Abstract: An OLED and a method for producing an OLED are disclosed. In an embodiment, the OLED includes a substrate and an organic layer stack with at least one active light-generating layer, which is suitable for generating electromagnetic radiation, wherein the organic layer stack is arranged between a first electrode and a second electrode. The OLED further includes a buffer layer arranged between the substrate and the first electrode, wherein the buffer layer includes an organic material, wherein a polymeric planarization layer is in direct contact with the substrate, wherein the buffer layer is in direct contact with the polymeric planarization layer, and wherein the first electrode is in direct contact with the buffer layer.
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公开(公告)号：US20210359268A1
公开(公告)日：2021-11-18
申请号：US17335534
申请日：2021-06-01
Applicant: OSRAM OLED GmbH
Inventor： Sebastian Wittmann , Arne Fleissner , Erwin Lang
Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a first electrode layer, an organic light-emitting layer stack abutting the first electrode layer, a second electrode layer abutting the light-emitting layer stack and a multilayer encapsulation abutting the second electrode layer, wherein the multilayer encapsulation comprises a barrier layer and a planarization layer, wherein the planarization layer abuts the second electrode layer, and wherein the planarization layer is arranged between the second electrode layer and the barrier layer.
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公开(公告)号：US20190173044A1
公开(公告)日：2019-06-06
申请号：US15776000
申请日：2017-08-25
Applicant: OSRAM OLED GmbH
Inventor： Erwin Lang , Thomas Wehlus , Arne Fleißner , Sebastian Wittmann
IPC: H01L51/52
Abstract: A method of producing a component module includes providing a component holder having a curved upper side and a radiation-emitting bendable component, and bending and fastening the component to the upper side so that the component has a curved shape.
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