公开(公告)号：US20180340682A1

公开(公告)日：2018-11-29

申请号：US15988074

申请日：2018-05-24

Applicant: OSRAM SYLVANIA Inc.

Inventor： Thomas Tessnow ,  Chad Ice ,  Vernon Price ,  Ryan Winczewski ,  Dwayne Mott

IPC: F21V29/76 ,  F21V29/75 ,  H05K1/02

Abstract: A light weight lighting module and devices including the same are disclosed. The module includes a printed circuit board with a first side and a second side, each including a conductive layer disposed thereon. The printed circuit board also includes thermal vias disposed therein, in thermal contact with the conductive layers on the first and second sides. One or more light sources are attached to the first side of the printed circuit board, such as high power light emitting diodes or laser light sources. A heat sink is attached to the second side of the printed circuit board. The light source(s) and heat sink are in thermal contact with the thermal vias of the printed circuit board so that thermal energy from the light source(s) can be transferred to the heat sink. The thermally-conductive layers and heat sink remain electrically isolated from the light source(s).