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公开(公告)号：US20150195433A1
公开(公告)日：2015-07-09
申请号：US14151406
申请日：2014-01-09
Applicant: OmniVision Technologies, Inc.
Inventor： Wei-Feng Lin , Yu-Kai Huang
CPC classification number: H04N5/2252 , G03B17/55 , H04N5/2253 , H04N5/2257 , H04N5/2259
Abstract: An imaging device provides efficient heat transfer by orienting components of the imaging device such that heat is transferred out of the imaging device instead of within the imaging device assembly. Heat is transferred out of the imaging device assembly through a printed circuit board to which the assembly housing is mounted thereon and/or through the housing itself.
Abstract translation: 成像装置通过使成像装置的部件定向而使得热量从成像装置而不是在成像装置组件内传送出来而提供有效的热传递。 热量通过印刷电路板从成像设备组件传送出去，组装壳体上安装有和/或通过壳体本身。
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公开(公告)号：US09258465B2
公开(公告)日：2016-02-09
申请号：US14151406
申请日：2014-01-09
Applicant: OmniVision Technologies, Inc.
Inventor： Wei-Feng Lin , Yu-Kai Huang
CPC classification number: H04N5/2252 , G03B17/55 , H04N5/2253 , H04N5/2257 , H04N5/2259
Abstract: An imaging device provides efficient heat transfer by orienting components of the imaging device such that heat is transferred out of the imaging device instead of within the imaging device assembly. Heat is transferred out of the imaging device assembly through a printed circuit board to which the assembly housing is mounted thereon and/or through the housing itself.
Abstract translation: 成像装置通过使成像装置的部件定向而使得热量从成像装置而不是在成像装置组件内传送出来而提供有效的热传递。 热量通过印刷电路板从成像设备组件传送出去，组装壳体上安装有和/或通过壳体本身。
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