公开(公告)号：US11096280B2

公开(公告)日：2021-08-17

申请号：US16605739

申请日：2018-05-17

申请人： Omron Corporation

发明人： Daichi Shimoda ,  Kazumune Kishikawa ,  Yasuyuki Kitahara ,  Tomonori Shiraishi ,  Shigeyuki Maeda ,  Yuta Fujise ,  Seiki Shimoda

IPC分类号： H05K5/00 ,  H05K1/11 ,  H05K1/02 ,  H05K1/18 ,  H05K5/06

摘要： A relay includes a relay main body (10) including a base (20) having a first surface (21), and a relay substrate (30) extending, in a direction intersecting the first surface (21), from a second surface (22) on the opposite side of the base (20) from the first surface (21), the relay substrate (30) being united with the base (20), and a case (50) attached to the relay main body (10) to cover the relay substrate (30), and the case (50) being filled with sealant. The relay main body (10) includes a board connector (23) provided on the first surface (21) of the base (20), an electronic component mounting portion (33) provided on the relay substrate (30), a conducting portion (40) provided on respective surfaces of the base (20) and the relay substrate (30), and an electronic component (34) mounted on the electronic component mounting portion (33).

公开(公告)号：US20210127488A1

公开(公告)日：2021-04-29

申请号：US16605739

申请日：2018-05-17

申请人： Omron Corporation

发明人： Daichi Shimoda ,  Kazumune Kishikawa ,  Yasuyuki Kitahara ,  Tomonori Shiraishi ,  Shigeyuki Maeda ,  Yuta Fujise ,  Seiki Shimoda

IPC分类号： H05K1/11 ,  H05K1/18 ,  H05K5/00 ,  H05K5/06 ,  H05K1/02

摘要： A relay includes a relay main body (10) including a base (20) having a first surface (21), and a relay substrate (30) extending, in a direction intersecting the first surface (21), from a second surface (22) on the opposite side of the base (20) from the first surface (21), the relay substrate (30) being united with the base (20), and a case (50) attached to the relay main body (10) to cover the relay substrate (30), and the case (50) being filled with sealant. The relay main body (10) includes a board connector (23) provided on the first surface (21) of the base (20), an electronic component mounting portion (33) provided on the relay substrate (30), a conducting portion (40) provided on respective surfaces of the base (20) and the relay substrate (30), and an electronic component (34) mounted on the electronic component mounting portion (33).