公开(公告)号：US11949204B2

公开(公告)日：2024-04-02

申请号：US18109998

申请日：2023-02-15

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Bryan Lochman ,  Matthew Sauter ,  Michael Denninger ,  Bien Chann ,  Keita Inoue ,  John Roethle

IPC: H01S3/04 ,  F28F21/08 ,  H01S5/024 ,  H05K7/20

CPC classification number: H01S3/0405 ,  F28F21/084 ,  H05K7/2049 ,  H05K7/20509 ,  H01S5/024

Abstract: In various embodiments, laser devices feature means, such as fasteners, for attaching a laser package to a cooling plate, which allow motion of the laser package in response to thermal cycles resulting from operation of a beam emitter therewithin. Embodiments of the invention additionally or instead include laser devices featuring segmented barrier layers for electrically isolating the laser package from the cooling plate.

公开(公告)号：US11611189B2

公开(公告)日：2023-03-21

申请号：US16597949

申请日：2019-10-10

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD

Inventor： Bryan Lochman ,  Matthew Sauter ,  Michael Denninger ,  Bien Chann ,  Keita Inoue ,  John Roethle

IPC: H01S3/04 ,  F28F21/08 ,  H05K7/20 ,  H01S5/024

Abstract: In various embodiments, laser devices feature means, such as fasteners, for attaching a laser package to a cooling plate, which allow motion of the laser package in response to thermal cycles resulting from operation of a beam emitter therewithin. Embodiments of the invention additionally or instead include laser devices featuring segmented barrier layers for electrically isolating the laser package from the cooling plate.