公开(公告)号：US20230355357A1

公开(公告)日：2023-11-09

申请号：US18056849

申请日：2022-11-18

Applicant: PING-CHENG LEE ,  CHIAO-I TSAI ,  JOY INTERNATIONAL CO.

Inventor： PING-CHENG LEE ,  CHIAO-I TSAI

IPC: A61C8/00 ,  A61C13/15

CPC classification number: A61C8/0012 ,  A61C8/0018 ,  A61C19/004

Abstract: A one-piece dental implant guide pack based on photocuring molding includes: a guide socket for receiving a photosensitive resin at an outer edge of the guide socket, adjusting and positioning the guide socket by the photosensitive resin which is curable by light; a guide slot formed at a side edge of the guide socket, and having a receiving portion at the bottom; a positioning shaft, having a positioning part and a shaft, and the positioning part being socketed into the guide socket, and the shaft penetrating to the bottom of the guide socket; and at least one positioning part, with an end connected to the guide socket and another end connected to and positioning the positioning shaft. This disclosure facilitates the drilling process of subsequent operations and improves the convenience and accuracy of the implant guide plate and the accuracy of the dental implant surgery.