公开(公告)号：US11101076B2

公开(公告)日：2021-08-24

申请号：US16495963

申请日：2018-03-21

申请人： POLITECNICO DI TORINO

发明人： Paolo Guglielmi ,  Fabio Freschi ,  Vincenzo Cirimele

IPC分类号： H01G4/33 ,  H01G4/224 ,  H01G4/12 ,  H01G4/14 ,  H05K1/16 ,  H02J50/12

摘要： A capacitive element is manufactured by using the multilayer printed circuit board technology. The body of the element includes a layer of dielectric material interposed between two layers of conductive material arranged on opposite sides of the layer of dielectric material. Each layer of conductive material is in turn covered, on its free side, with an external covering layer. The material for making the layer of dielectric material is chosen among materials having: —a dielectric permeability εr>1, —a dielectric rigidity k>100 kV/mm, and —a loss figure Df≤0.002. Furthermore, the dimensions of the layer of dielectric material are greater than the dimensions of the layers of conductive material, so as to limit the edge effects that might cause discharge phenomena and make the capacitive element flexible.