公开(公告)号：US20240343904A1

公开(公告)日：2024-10-17

申请号：US18580084

申请日：2022-06-15

申请人： POLYPLASTICS-EVONIK CORPORATION

发明人： Mitsuteru MUTSUDA ,  Takuya OCHIAI ,  Daisuke FUJIKI

IPC分类号： C08L77/10 ,  B32B25/04 ,  B32B27/08 ,  B32B27/34 ,  B32B38/00 ,  C08J5/18

CPC分类号： C08L77/10 ,  B32B25/04 ,  B32B27/08 ,  B32B27/34 ,  B32B38/004 ,  C08J5/18 ,  B32B2038/0076 ,  B32B2250/02 ,  B32B2307/51 ,  B32B2319/00 ,  B32B2377/00 ,  C08J2377/10

摘要： The present disclosure provides a thermoplastic resin composition and the like to be used for molding a resin sheet, in which the resin sheet is to be used in cross-linking adhesion with rubber. The thermoplastic resin composition includes a thermoplastic resin including a first polyamide (A) having a melting point of from 180° C. to 230° C. and a block copolymer (B) containing a second polyamide and a polyether. A ratio of a weight of the first polyamide (A) to a weight of the block copolymer (B) is from 65/35 to 85/15, and the thermoplastic resin composition has an amino group concentration of 20 mmol/kg or more.