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公开(公告)号:US20170362676A1
公开(公告)日:2017-12-21
申请号:US15539610
申请日:2015-12-21
Applicant: POSCO
Inventor: Se Il LEE , Hun Ju LEE
IPC: C21D9/46 , C22C38/14 , C22C38/06 , C21D8/12 , C22C38/02 , C22C38/00 , C21D6/00 , C22C38/60 , C22C38/04
CPC classification number: C21D9/46 , C21D6/008 , C21D8/12 , C21D8/1222 , C21D8/1233 , C21D8/1261 , C22C38/001 , C22C38/002 , C22C38/004 , C22C38/008 , C22C38/02 , C22C38/04 , C22C38/06 , C22C38/14 , C22C38/60
Abstract: A method for manufacturing a non-oriented electrical steel sheet according to an exemplary embodiment of the present invention includes performing hot rolling on a slab after heating the slab to manufacture a hot rolled sheet; performing hot rolled sheet annealing on the hot rolled sheet; performing cold rolling on a steel sheet on which the hot rolled sheet annealing is completed to manufacture a cold rolled sheet; and performing cold rolled sheet annealing on the cold rolled sheet in which a difference between a cold rolled sheet annealing temperature in the cold rolled sheet annealing and a hot rolled sheet annealing temperature in the hot rolled sheet annealing is 100° C. or lower.
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公开(公告)号:US20230021013A1
公开(公告)日:2023-01-19
申请号:US17784444
申请日:2020-12-17
Applicant: POSCO
Inventor: Se Il LEE , Hyunwoo MUN
Abstract: A non-oriented electrical steel sheet according to an embodiment of the present invention includes, in wt %, Si: 1.5% or less, C: 0.01% or less (excluding 0%), Mn: 0.03 to 3%, P: 0.01 to 0.2%, S: 0.001 to 0.02%, Al: 0.01% or less (excluding 0%), N: 0.005% or less (excluding 0%), Cu: 0.02 to 0.3%, 0.0001 to 0.005 wt % of Ca and Mg either alone or in total, 0.001 to 0.2 wt % of Sb and Sn either alone or in total, and a balance of Fe and inevitable impurities.
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公开(公告)号:US20200087748A1
公开(公告)日:2020-03-19
申请号:US16470784
申请日:2017-12-19
Applicant: POSCO
Inventor: Se Il LEE , June Soo PARK , Jae Hoon KIM
IPC: C21D9/46 , C22C38/16 , C22C38/06 , C22C38/04 , C22C38/02 , C22C38/00 , C21D8/12 , C21D8/00 , C21D6/00 , H01F1/147
Abstract: The non-oriented electrical steel sheet according to one embodiment of the present invention includes: by weight, 2.0% to 4.0% of Si; 0.001% to 2.0% of Al; 0.0005% to 0.009% of S; 0.02% to 1.0% of Mn, 0.0005% to 0.004% of N; 0.004% or less of C (excluding 0%); 0.005% to 0.07% of Cu; 0.0001% to 0.007% of O; individually or in a total amount of 0.05% to 0.2% of Sn or P; and the remainder comprising Fe and impurities; wherein the non-oriented electrical steel sheet is composed of a surface portion to 2 μm from the surface of the steel sheet in the thickness direction and a base portion exceeding 2 μm from the surface of the steel sheet in the thickness direction, and wherein the number of surfides having a diameter of 10 nm to 100 nm is larger than the number of the nitrides having a diameter of 10 nm to 100 nm, in the same area of base portion.
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公开(公告)号:US20230060392A1
公开(公告)日:2023-03-02
申请号:US17784379
申请日:2020-12-17
Applicant: POSCO
Inventor: Se Il LEE , Hyunwoo MUN
IPC: C21D9/46 , C21D8/12 , C21D6/00 , C22C38/14 , C22C38/06 , C22C38/04 , C22C38/02 , C22C38/00 , H01F1/147
Abstract: A double-oriented electrical steel sheet according to an example of the present invention comprises, by weight 2.0 to 4.0 wt % of Si, 0.01 to 0.04 wt % of Al, 0.0004 to 0.02 wt % of S, 0.05 to 0.3 wt % of Mn, at most 0.01 wt % (exclusive of 0 wt %) of N, at most 0.005 wt % (exclusive of 0 wt %) of C, 0.005 to 0.15 wt % of P, 0.001 to 0.005 wt % of Ti, and 0.0001 to 0.005 wt % of Mg, with the balance being Fe and other inevitable impurities, wherein the area fraction of crystal grains having an orientation within 15° from {100} is 60 to 99%, and the area fraction of crystal grains having an orientation within 15° from {100} is 1 to 30%.
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公开(公告)号:US20190017136A1
公开(公告)日:2019-01-17
申请号:US16065783
申请日:2016-12-23
Applicant: POSCO
Inventor: Se Il LEE
IPC: C21D8/12 , C22C38/02 , C22C38/00 , C22C38/04 , C22C38/06 , C22C38/16 , C22C38/44 , C22C38/42 , C22C38/46 , C22C38/48 , C22C38/50 , C22C38/14 , C22C38/60
Abstract: A non-oriented electrical steel sheet according to one embodiment of the present invention comprises, by weight, 1.0% to 4.0% of Si, 0.001% to 0.01% of Al, 0.002%⋅to 0.009% of S, 0.01% to 0.3% of Mn, 0.001% to 0.004% of N, 0.004% or less (0% exclusive) of C, 0.003% or less (0% exclusive) of Ti, 0.005% to 0.07% of Cu, 0.05% to 0.2% of either or both of Sn and P, and a balance amount of Fe and impurities.
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