利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

5 条记录 (耗时 0.017 秒)

    OPTICAL SEMICONDUCTOR LIGHTING APPARATUS
    1.
    发明申请
    OPTICAL SEMICONDUCTOR LIGHTING APPARATUS 审中-公开
    光学半导体照明设备

    公开(公告)号：US20150062914A1

    公开(公告)日：2015-03-05

    申请号：US14538624

    申请日：2014-11-11

    申请人： Posco Led Company Ltd.

    发明人： Dong Soo KIM ,  Seok Jin Kang ,  Kyoo Seok Kim ,  Yoon Gil Jang ,  Dong Hee Kim ,  Seong Bok Yoon ,  Jung Hwa Kim

    IPC分类号： F21V15/01 ,  F21V29/00

    CPC分类号： F21V15/011 ,  F21V17/005 ,  F21V29/2231 ,  F21V29/2293 ,  F21V29/507 ,  F21V29/70 ,  F21V29/773 ,  F21V29/83 ,  F21Y2105/10 ,  F21Y2115/10

    摘要： A first heat sinking path formed in a forming direction of a heat sink unit disposed radially in a housing where a light emitting module is mounted. A second heat sinking path is formed along an edge of the light emitting module. By providing a light engine concept in which a light emitting module, an optical member, and a heat sink unit are included and a bottom surface is gradually widened from one side to the other side, an optical semiconductor lighting apparatus can reduce a total weight of a product, can further improve heat dissipation efficiency by inducing natural convection, is simple in the product assembly and installation, and is easy in maintenance, and can provide products with high reliability by increasing the arrangement efficiency of semiconductor optical devices per unit area.

    摘要翻译： 在散热单元的形成方向上形成的第一散热路径，其放置在安装有发光模块的壳体内。 沿着发光模块的边缘形成第二散热路径。 通过提供其中包括发光模块，光学构件和散热单元并且底表面从一侧逐渐变宽到另一侧的光引擎概念，光半导体照明装置可以减少 产品可以通过引入自然对流进一步提高散热效率，产品组装安装简单，维护方便，通过提高单位面积半导体光学器件的布置效率，可以提供高可靠性的产品。

    OPTICAL SEMICONDUCTOR LIGHTING APPARATUS
    2.
    发明申请
    OPTICAL SEMICONDUCTOR LIGHTING APPARATUS 有权
    光学半导体照明设备

    公开(公告)号：US20140043833A1

    公开(公告)日：2014-02-13

    申请号：US14056663

    申请日：2013-10-17

    申请人： POSCO LED COMPANY LTD.

    发明人： Dong Soo KIM ,  Seok Jin KANG ,  Kyoo Seok KIM ,  Yoon Gil JANG ,  Dong Hee KIM ,  Seong Bok YOON ,  Jung Hwa KIM

    IPC分类号： F21V29/00

    CPC分类号： F21V15/011 ,  F21V17/005 ,  F21V29/2231 ,  F21V29/2293 ,  F21V29/507 ,  F21V29/70 ,  F21V29/773 ,  F21V29/83 ,  F21Y2105/10 ,  F21Y2115/10

    摘要： A first heat sinking path formed in a forming direction of a heat sink unit disposed radially in a housing where a light emitting module is mounted. A second heat sinking path is formed along an edge of the light emitting module. By providing a light engine concept in which a light emitting module, an optical member, and a heat sink unit are included and a bottom surface is gradually widened from one side to the other side, an optical semiconductor lighting apparatus can reduce a total weight of a product, can further improve heat dissipation efficiency by inducing natural convection, is simple in the product assembly and installation, and is easy in maintenance, and can provide products with high reliability by increasing the arrangement efficiency of semiconductor optical devices per unit area.

    摘要翻译： 在散热单元的形成方向上形成的第一散热路径，其放置在安装有发光模块的壳体内。 沿着发光模块的边缘形成第二散热路径。 通过提供其中包括发光模块，光学构件和散热单元并且底表面从一侧逐渐变宽到另一侧的光引擎概念，光半导体照明装置可以减少 产品可以通过引入自然对流进一步提高散热效率，产品组装安装简单，维护方便，通过提高单位面积半导体光学器件的布置效率，可以提供高可靠性的产品。

    OPTICAL SEMICONDUCTOR LIGHTING APPARATUS
    3.
    发明申请
    OPTICAL SEMICONDUCTOR LIGHTING APPARATUS 审中-公开
    光学半导体照明设备

    公开(公告)号：US20130314914A1

    公开(公告)日：2013-11-28

    申请号：US13683414

    申请日：2012-11-21

    申请人： POSCO LED COMPANY LTD.

    发明人： Dong Soo KIM ,  Seok Jin Kang ,  Yoon Gil Jang ,  Su Woon Lee ,  Dong Hee Kim

    IPC分类号： F21V29/00 ,  F21V15/01

    CPC分类号： F21V23/04 ,  F21V15/01 ,  F21V23/023 ,  F21V29/51 ,  F21V29/717 ,  F21V29/773 ,  F21V29/83 ,  F21Y2115/10 ,  F28D15/0275 ,  F28F1/325

    摘要： An optical semiconductor lighting apparatus includes: a light emitting module including one or more semiconductor optical devices; a switching mode power supply (SMPS) connected to the light emitting module; a housing disposed to be adjacent to the light emitting module, in which the housing has both ends opened and accommodates the SMPS; a first heat dissipation unit disposed at an inner side of the housing; and a second heat dissipation unit disposed radially at an outer side of the housing and formed from an outer side of one end portion of the housing to the edge of the light emitting module. The first heat dissipation unit includes a plurality of heat dissipation plates through which the heat pipe penetrates, and a plurality of vent portions formed on the heat dissipation plates.

    摘要翻译： 光学半导体照明装置包括：发光模块，包括一个或多个半导体光学器件; 连接到发光模块的开关模式电源（SMPS）; 壳体，被布置成与所述发光模块相邻，所述壳体的两端打开并容纳所述SMPS; 设置在所述壳体的内侧的第一散热单元; 以及第二散热单元，径向地设置在所述壳体的外侧，并且从所述壳体的一个端部的外侧到所述发光模块的边缘形成。 第一散热单元包括多个散热板，热管穿过该散热板，以及形成在散热板上的多个通气部。