公开(公告)号：US20220340444A1

公开(公告)日：2022-10-27

申请号：US17641009

申请日：2020-10-07

Applicant: POWDERTECH CO., LTD.

Inventor： Koji AGA ,  Takashi KOJIMA ,  Takao SUGIURA ,  Tadashi TSUDUKI ,  Satomi KONNO ,  Sho KUWAHARA

IPC: C01G49/06 ,  C01G49/00 ,  H05K9/00 ,  C08L63/00

Abstract: Provided are: a ferrite powder whereby, when the ferrite powder is applied in a composite material, dropping out of ferrite particles is suppressed without moldability and filling ability being compromised; a ferrite resin composite material; and an electromagnetic shielding material, an electronic material, or an electronic component. This ferrite powder includes at least spherical or polyhedral ferrite particles in which a step structure is provided on surfaces thereof, the step structure having a polyhedral outline in the surfaces of the ferrite particles.

公开(公告)号：US20230085745A1

公开(公告)日：2023-03-23

申请号：US17795382

申请日：2021-01-27

Applicant: POWDERTECH CO., LTD.

Inventor： Koji AGA ,  Takashi KOJIMA ,  Takao SUGIURA ,  Sho KUWAHARA ,  Satomi KONNO ,  Tadashi TSUDUKI

IPC: H01F1/34 ,  C01G49/00

Abstract: Provided are a ferrite powder capable of maintaining a high withstand voltage even when used in a resin composition having high magnetic properties and electrical resistivity and a high filling ratio, and a method for producing the same. A ferrite powder composed of spherical ferrite particles, wherein the ferrite powder contains iron (Fe): 55.0-70.0 mass % and manganese (Mn): 3.5-18.5 mass %, the ferrite powder containing more than 0.0 mass % to 7.5 mass % α-Fe2O3, and the ferrite powder has a volume average particle size (D50) of 15.0 μm or less.

公开(公告)号：US20210047200A1

公开(公告)日：2021-02-18

申请号：US16967197

申请日：2019-02-06

Applicant: POWDERTECH CO., LTD.

Inventor： Koji AGA ,  Takashi KOJIMA ,  Kazutaka ISHII ,  Tetsuya IGARASHI ,  Sho KUWAHARA

IPC: C01G49/00 ,  C08L29/04 ,  H05K9/00

Abstract: Provided are: an Mn ferrite powder characterized by including a plurality of ferrite particles, having a volume-average particle diameter of 1-10 μm, and having a 2.106 μm volume-based cumulative distribution (sieved) of 0.1-50.0 vol %; and a resin composition characterized by including said powder and a resin material.