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公开(公告)号:US11824301B2
公开(公告)日:2023-11-21
申请号:US17690712
申请日:2022-03-09
发明人: Kiyokatsu Akimoto , Shuzo Isoda , Yasutoki Manda
IPC分类号: H01R13/533 , H01R12/73
CPC分类号: H01R13/533 , H01R12/732
摘要: Provided is an inter-board connection structure including: a first connector provided to the first board; a second connector provided to the second board, the second connector electrically connecting between the first board and the second board; and a vibration suppressor provided on a side of a surface opposite to a first surface where the second connector is placed, the surface opposite to the first surface being referred to as a second surface, the vibration suppressor supporting the second board from the side of the second surface to suppress vibration generated between the first board and the second board.