公开(公告)号：US20210327935A1

公开(公告)日：2021-10-21

申请号：US17359715

申请日：2021-06-28

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： AKIO NAKAJUN ,  HIDEYUKI ODAHARA ,  MANABU TSUNODA

IPC: H01L27/146

Abstract: An imaging device includes: a semiconductor substrate including a pixel region in which a plurality of pixels are arranged, and a peripheral region that surrounds the pixel region; a resin layer including a first side surface having a first curved surface, and a second side surface located away from the pixel region further than the first side surface, the resin layer being located on the peripheral region; a sealing layer which overlaps with the pixel region and the periphery region in a plan view, and seals the plurality of pixels; and a first light shielding layer which is located between the resin layer and the sealing layer, and overlaps with at least part of the first curved surface in the plan view.