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公开(公告)号：US10327324B2
公开(公告)日：2019-06-18
申请号：US15308601
申请日：2015-05-14
Inventor： Nobuyuki Matsui , Makoto Ohno , Hiroyuki Yamada
Abstract: A circuit board includes a heat storage body, an insulating layer provided on the heat storage body, a wiring board provided on the insulating layer, and a heat generating component provided on the wiring board. The insulating layer is provided independently of the wiring board. The wiring board is provided with a heat transfer metal portion penetrating through the wiring board and facing the heat generating component. The insulating layer is provided with a heat transfer resin portion penetrating through the insulating layer and facing the heat transfer metal portion. The heat transfer resin portion and a part of the insulating layer are interposed between the heat transfer metal portion and the heat storage body.
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公开(公告)号：US09787215B2
公开(公告)日：2017-10-10
申请号：US15300741
申请日：2015-05-25
Inventor： Makoto Ohno , Shota Yamamoto , Ichiro Ishida , Tetsuya Ishitsuka
CPC classification number: H02M7/003 , G05F1/56 , H02M1/32 , H02M3/00 , H02M3/1584
Abstract: A power supply device includes a board that includes an input terminal and an output terminal, and converters disposed on the board. The converters are connected with each other in parallel and convert an input voltage input to the input terminal, and output the converted voltage to the output terminal. Each of the converters includes respective one of voltage conversion functional units including respective one of input parts and respective one of output parts, respective one of input line parts connected to respective one of the input parts. Respective one of output line parts connected to respective one of the output parts, and respective one of current adjustment functional units provided in respective one of the output line parts for balancing currents output from the each of the converters provided in respective one of the output line parts.
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