公开(公告)号：US20230219166A1

公开(公告)日：2023-07-13

申请号：US18174604

申请日：2023-02-24

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： YOICHI FUKUMITSU ,  TAKAYASU OHARA ,  MASATOSHI NISHIO

IPC: B23K26/035 ,  B23K26/08

CPC classification number: B23K26/035 ,  B23K26/0884

Abstract: Laser processing device (100) includes a laser oscillator that generates laser beam (LB), laser head (60) that irradiates a workpiece with laser beam (LB), and manipulator (40) on which laser head (60) is mounted. Manipulator (40) includes robot arm (41), arm tip shaft (J6) provided at a tip of robot arm (41) in a manner rotatable about axis (RA), and connector component (50) that connects arm tip shaft (J6) and laser head (60). Connector component (50) is provided with gauge attachment portion (51a) to which gauge (80) is attached removably. Gauge (80) has a reference point corresponding to the focal position of laser beam (LB).