公开(公告)号：US20220059431A1

公开(公告)日：2022-02-24

申请号：US17418826

申请日：2020-01-15

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： AKIHITO KONISHI ,  NORIHIRO KAWAMURA ,  YOUJI SHIRATO ,  NAOKI SAITOU

IPC: H01L23/373

Abstract: An object of the present disclosure is to provide a heat conducting sheet that can be easily positioned and can absorb unevenness of a heat generating component and a heat radiating component to reduce thermal resistance, and an electronic device using the same. Heat conducting sheet includes rectangular graphite sheet and attachment sheet that covers graphite sheet, graphite sheet being exposed at least two opposite sides. Graphite sheet is exposed from between attachment sheets, a thickness of attachment sheet is made thinner than (T0-T1) where an initial thickness of graphite sheet is T0, and a thickness when a pressure of 100 kPa is applied to the graphite sheet is T1.