公开(公告)号：US10522947B2

公开(公告)日：2019-12-31

申请号：US16032665

申请日：2018-07-11

Applicant: Panduit Corp.

Inventor： Satish I. Patel ,  Roman J. Churnovic ,  Jean de Deiu Mutangana

IPC: H01R13/6464 ,  H01R24/64 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/6469

Abstract: Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.

公开(公告)号：US20180323547A1

公开(公告)日：2018-11-08

申请号：US16032665

申请日：2018-07-11

Applicant: Panduit Corp.

Inventor： Satish I. Patel ,  Roman J. Churnovic ,  Jean de Deiu Mutangana

IPC: H01R13/6464 ,  H01R13/6461 ,  H01R13/6466 ,  H01R24/64 ,  H01R13/6469

CPC classification number: H01R13/6464 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/6469 ,  H01R24/64

Abstract: Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.