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公开(公告)号:US11165202B2
公开(公告)日:2021-11-02
申请号:US16730281
申请日:2019-12-30
Applicant: Panduit Corp.
Inventor: Satish I. Patel , Roman J. Churnovic , Jean de Dieu Muntangana
IPC: H01R13/646 , H01R13/6464 , H01R24/64 , H01R13/6461 , H01R13/6466 , H01R13/6469
Abstract: Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.
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公开(公告)号:US20220059971A1
公开(公告)日:2022-02-24
申请号:US17517022
申请日:2021-11-02
Applicant: Panduit Corp.
Inventor: Satish I. Patel , Roman J. Churnovic , Jean de Dieu Muntangana
IPC: H01R13/6464 , H01R24/64 , H01R13/6461 , H01R13/6466 , H01R13/6469
Abstract: Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.
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