Communication jack having a dielectric film between plug interface contacts

    公开(公告)号:US11165202B2

    公开(公告)日:2021-11-02

    申请号:US16730281

    申请日:2019-12-30

    Applicant: Panduit Corp.

    Abstract: Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.

    Communication Jack Having a Dielectric Film Between Plug Interface Contacts

    公开(公告)号:US20220059971A1

    公开(公告)日:2022-02-24

    申请号:US17517022

    申请日:2021-11-02

    Applicant: Panduit Corp.

    Abstract: Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.

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