公开(公告)号：US11165202B2

公开(公告)日：2021-11-02

申请号：US16730281

申请日：2019-12-30

Applicant: Panduit Corp.

Inventor： Satish I. Patel ,  Roman J. Churnovic ,  Jean de Dieu Muntangana

IPC: H01R13/646 ,  H01R13/6464 ,  H01R24/64 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/6469

Abstract: Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.

公开(公告)号：US20220059971A1

公开(公告)日：2022-02-24

申请号：US17517022

申请日：2021-11-02

Applicant: Panduit Corp.

Inventor： Satish I. Patel ,  Roman J. Churnovic ,  Jean de Dieu Muntangana

IPC: H01R13/6464 ,  H01R24/64 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/6469

Abstract: Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.