公开(公告)号：US20090029554A1

公开(公告)日：2009-01-29

申请号：US11828147

申请日：2007-07-25

申请人： Patty Pei-Ling Chang-Chien ,  Chi Kong Cheung ,  Melanie Sachiko Yajima ,  Xianglin Zeng

发明人： Patty Pei-Ling Chang-Chien ,  Chi Kong Cheung ,  Melanie Sachiko Yajima ,  Xianglin Zeng

IPC分类号： H01L21/00

CPC分类号： H01L23/66 ,  H01L21/6835 ,  H01L21/6836 ,  H01L25/16 ,  H01L2221/68327 ,  H01L2223/6677 ,  H01L2224/16145 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/1423 ,  H01Q1/38 ,  H01L2924/00 ,  H01L2224/81

摘要： A method for mounting a dielectric substrate to a semiconductor substrate, such as mounting a dielectric antenna substrate to an MMIC semiconductor substrate. The method includes providing a thin dielectric antenna substrate having metallized layers on opposing sides. In one embodiment, carrier wafers are used to handle and maintain the dielectric substrate in a flat configuration as the metallized layers are patterned. The dielectric substrate is sealed to the semiconductor substrate using a low temperature bonding process. In an alternate embodiment, the metallized layers on the dielectric substrate are patterned simultaneously so as to prevent the substrate from curling.

摘要翻译： 将电介质基板安装到半导体基板上的方法，例如将电介质天线基板安装到MMIC半导体基板上。 该方法包括提供在相对侧上具有金属化层的薄介电天线基板。 在一个实施例中，当金属化层被图案化时，载体晶片用于处理和维持电介质基板处于平坦配置。 使用低温接合工艺将电介质基板密封到半导体基板。 在替代实施例中，电介质基板上的金属化层被同时图案化，以防止基板卷曲。

公开(公告)号：US07696062B2

公开(公告)日：2010-04-13

申请号：US11828147

申请日：2007-07-25

申请人： Patty Pei-Ling Chang-Chien ,  Chi Kong Cheung ,  Melanie Sachiko Yajima ,  Xianglin Zeng

发明人： Patty Pei-Ling Chang-Chien ,  Chi Kong Cheung ,  Melanie Sachiko Yajima ,  Xianglin Zeng

IPC分类号： H01L21/30

CPC分类号： H01L23/66 ,  H01L21/6835 ,  H01L21/6836 ,  H01L25/16 ,  H01L2221/68327 ,  H01L2223/6677 ,  H01L2224/16145 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/1423 ,  H01Q1/38 ,  H01L2924/00 ,  H01L2224/81

摘要： A method for mounting a dielectric substrate to a semiconductor substrate, such as mounting a dielectric antenna substrate to an MMIC semiconductor substrate. The method includes providing a thin dielectric antenna substrate having metallized layers on opposing sides. In one embodiment, carrier wafers are used to handle and maintain the dielectric substrate in a flat configuration as the metallized layers are patterned. The dielectric substrate is sealed to the semiconductor substrate using a low temperature bonding process. In an alternate embodiment, the metallized layers on the dielectric substrate are patterned simultaneously so as to prevent the substrate from curling.

摘要翻译： 将电介质基板安装到半导体基板上的方法，例如将电介质天线基板安装到MMIC半导体基板上。 该方法包括提供在相对侧上具有金属化层的薄介电天线基板。 在一个实施例中，当金属化层被图案化时，载体晶片用于处理和维持电介质基板处于平坦配置。 使用低温接合工艺将电介质基板密封到半导体基板。 在替代实施例中，电介质基板上的金属化层被同时图案化，以防止基板卷曲。