Method for electrophoretic coating
    1.
    发明授权
    Method for electrophoretic coating 失效
    电泳涂层方法

    公开(公告)号:US07964082B2

    公开(公告)日:2011-06-21

    申请号:US11752901

    申请日:2007-05-23

    Inventor: Peng-Cheng Tong

    CPC classification number: C25D13/20 C23C18/1653 C23C18/285 C23C18/30

    Abstract: An exemplary electrophoretic coating method and an electroplated shell (800) manufactured thereby is provided. The electrophoretic coating method includes the following steps. A first step (Step S1) is to mold a base shell (500). The base shell includes a base body (50), a shell body (60), and a connecting body (70). The shell body and the connecting body are molded with the base body. The connecting body connects with the shell body. A second step (Step S2) is to pretreat the shell body and the connecting body. Thus, conducting films are formed on the shell body and connecting body. A third step (Step S3) is to electrophoretically coat the preliminarily treated base shell, so as to form electroplated layers on the shell body. A fourth step (Step S4) is to remove the connecting body so as to form/yield the electroplated shell.

    Abstract translation: 提供了由此制造的示例性电泳涂覆方法和电镀壳(800)。 电泳涂布方法包括以下步骤。 第一步(步骤S1)是模制基壳(500)。 基座壳体包括基体(50),壳体(60)和连接体(70)。 壳体和连接体与基体成型。 连接体与壳体连接。 第二步骤(步骤S2)是对壳体和连接体进行预处理。 因此,在壳体和连接体上形成导电膜。 第三步骤(步骤S3)是对预先处理的基壳进行电泳涂布,以在壳体上形成电镀层。 第四步骤(步骤S4)是去除连接体以形成/产生电镀壳体。

    Housing for electronic devices and method for making the same
    2.
    发明授权
    Housing for electronic devices and method for making the same 有权
    电子设备外壳及其制造方法

    公开(公告)号:US08422205B2

    公开(公告)日:2013-04-16

    申请号:US12911831

    申请日:2010-10-26

    CPC classification number: H04M1/0283 B29C45/0055 B29C45/36 B29C2045/0058

    Abstract: An electronic device includes a housing and an electronic module. The housing includes a transparent main body, a masking layer partially adhered to the transparent main body, and a cover. A bare area is exposed forming the masking layer to define a transparent window. The housing defines a receiving chamber and an open end communicating with the receiving chamber. The electronic module includes a touch display screen. The electronic module is received in the receiving chamber, the touch display screen aligns to the transparent window, and the cover seals the open end. The present disclosure further discloses a housing for the electronic device and a method for making the housing.

    Abstract translation: 电子设备包括壳体和电子模块。 壳体包括透明主体,部分地粘附到透明主体的掩模层和盖。 曝光的裸露区域形成掩模层以限定透明窗口。 壳体限定接收室和与接收室连通的开口端。 电子模块包括触摸显示屏。 电子模块被容纳在接收室中,触摸显示屏幕与透明窗口对准,盖子封闭开口端。 本公开进一步公开了一种用于电子设备的壳体和用于制造壳体的方法。

    Housing and electronic device using the same
    4.
    发明授权
    Housing and electronic device using the same 有权
    外壳和电子设备使用相同

    公开(公告)号:US08446711B2

    公开(公告)日:2013-05-21

    申请号:US12911843

    申请日:2010-10-26

    CPC classification number: H04M1/0283

    Abstract: A housing includes housing and a cover. The housing defines a receiving chamber and an open end communicating with the receiving chamber. The housing includes an opaque plastic member and a transparent glass member adhered to the plastic member. The opaque plastic member defines a display window hole. The cover seals the open end. The present disclosure further discloses an electronic device using the housing.

    Abstract translation: 外壳包括外壳和盖子。 壳体限定接收室和与接收室连通的开口端。 壳体包括不透明的塑料构件和粘附到塑料构件的透明玻璃构件。 不透明塑料构件限定了显示窗孔。 盖子封闭开口端。 本公开还公开了一种使用该壳体的电子设备。

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