公开(公告)号：US20240179832A1

公开(公告)日：2024-05-30

申请号：US18435821

申请日：2024-02-07

申请人： Phil Geng ,  Xiaoning Ye ,  Yipeng Zhong ,  Meng Wang ,  Hongfei Yan ,  Chuansheng Liu ,  Lejie Liu ,  Mohanraj Prabhugoud ,  Fernando Gonzalez Lenero ,  Dongwang Chen ,  Sanjoy Saha ,  Ralph Miele ,  Baris Bicen ,  David Shia ,  Jeffory Smalley ,  Eric Erike

发明人： Phil Geng ,  Xiaoning Ye ,  Yipeng Zhong ,  Meng Wang ,  Hongfei Yan ,  Chuansheng Liu ,  Lejie Liu ,  Mohanraj Prabhugoud ,  Fernando Gonzalez Lenero ,  Dongwang Chen ,  Sanjoy Saha ,  Ralph Miele ,  Baris Bicen ,  David Shia ,  Jeffory Smalley ,  Eric Erike

IPC分类号： H05K1/02

CPC分类号： H05K1/0263 ,  H05K2201/10189 ,  H05K2201/2009

摘要： A multi-entry socket power delivery structure is attachable to a printed circuit board to provide improved delivery of one or more power supply signals to a socket. The power delivery structure provides an additional path for power supply signals to be delivered to a socket (in addition to the “power corridor” of the printed circuit board). The power delivery structure comprises one or more portions, with individual portions comprising a printed circuit board connection portion that attaches to the printed circuit board to receive a power supply signal generated by a voltage regulator, and a socket connection portion that attaches to the printed circuit board to deliver the power supply signal to the socket via the printed circuit board. The power delivery structure can be located in the recess of a reinforced backplate that provides structural integrity to a processor stack and associated thermal management solution loading mechanism.