公开(公告)号：US08687379B2

公开(公告)日：2014-04-01

申请号：US13779166

申请日：2013-02-27

申请人： Phytrex Technology Corporation

发明人： Feng-Chi Hsiao ,  Kun-Shan Yang ,  Tung-Fu Lin ,  Chin-Fen Cheng ,  Chih-Wei Lee

IPC分类号： H05K1/11

CPC分类号： H05K1/14 ,  G06K7/10237 ,  G06K19/072 ,  G06K19/07741 ,  G06K19/07749 ,  G06K19/07769

摘要： The present invention provides a dual chip signal conversion device, comprising: a carrier, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact; a first chip disposed at one side surface of the carrier and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the carrier and electrically connected to the first chip; and an antenna disposed within the carrier and electrically connected to the second chip.

摘要翻译： 本发明提供一种双芯片信号转换装置，包括：载体，其一个侧表面设置有至少第一触点和第二触点，而另一个侧表面设置有至少第三触点和第四触点 ; 第一芯片，设置在所述载体的一个侧表面处并电连接到所述第二和第四触点; 第二芯片，设置在所述载体的一个侧表面处并电连接到所述第一芯片; 以及设置在所述载体内并电连接到所述第二芯片的天线。

公开(公告)号：US20130170168A1

公开(公告)日：2013-07-04

申请号：US13779166

申请日：2013-02-27

申请人： Phytrex Technology Corporation

发明人： Feng-Chi Hsiao ,  Kun-Shan Yang ,  Tung-Fu Lin ,  Chin-Fen Cheng ,  Chih-Wei Lee

IPC分类号： H05K1/14

CPC分类号： H05K1/14 ,  G06K7/10237 ,  G06K19/072 ,  G06K19/07741 ,  G06K19/07749 ,  G06K19/07769

摘要： The present invention provides a dual chip signal conversion device, comprising: a carrier, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact; a first chip disposed at one side surface of the carrier and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the carrier and electrically connected to the first chip; and an antenna disposed within the carrier and electrically connected to the second chip.

摘要翻译： 本发明提供一种双芯片信号转换装置，包括：载体，其一个侧表面设置有至少第一触点和第二触点，而另一个侧表面设置有至少第三触点和第四触点 ; 第一芯片，设置在所述载体的一个侧表面处并电连接到所述第二和第四触点; 第二芯片，设置在所述载体的一个侧表面处并电连接到所述第一芯片; 以及设置在所述载体内并电连接到所述第二芯片的天线。