METHOD FOR BONDING HETEROGENEOUS SUBSTRATES
    1.
    发明申请

    公开(公告)号:US20180178500A1

    公开(公告)日:2018-06-28

    申请号:US15585500

    申请日:2017-05-03

    CPC classification number: B32B37/10 B32B38/0008 B32B2310/0831

    Abstract: A method for bonding heterogeneous substrates includes the steps of: applying ultraviolet radiation to a surface of a first substrate made of plastics, engineering plastics composite or a metal material;adhering a second substrate raw material to the UV radiation treated surface of the first substrate, the second substrate raw material being fluorinated hydrocarbon rubber or silicone rubber; and press molding the first substrate and the second substrate raw material so as to bond the first substrate and a second substrate of the second substrate raw material together.

Patent Agency Ranking