公开(公告)号：US20070090504A1

公开(公告)日：2007-04-26

申请号：US11225077

申请日：2005-09-14

申请人： Po-Hung Chen ,  Chin-Cheng Lo ,  Mao-Jung Chen

发明人： Po-Hung Chen ,  Chin-Cheng Lo ,  Mao-Jung Chen

IPC分类号： H01L23/02

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention relates to an optical sensor chip package in a cavity of forming frame thereof and has a gap between protection layer and optical sensor chip. The optical sensor chip avoids accepting the pressure from protection layer that damage the reliability between pads and metallic traces when protection layer lay on the forming frame. It improves drawbacks of the glue pass trough the gap between optical sensor chip and pads into the optical sensor area of optical sensor chip. It improves the high process yield and reduces the height of optical sensor chip package to achieve lightly and thinly.

摘要翻译： 本发明涉及其形成框架的空腔中的光学传感器芯片封装，并且在保护层和光学传感器芯片之间具有间隙。 当保护层位于成型框架上时，光学传感器芯片避免接受来自保护层的压力，从而损坏焊盘和金属迹线之间的可靠性。 它改善了光学传感器芯片和焊盘之间的间隙的胶合通过光学传感器芯片的光学传感器区域的缺点。 它提高了高工艺成品率，降低了光学传感器芯片封装的高度，实现轻薄。

公开(公告)号：US07405456B2

公开(公告)日：2008-07-29

申请号：US11225077

申请日：2005-09-14

申请人： Po-Hung Chen ,  Chin-Cheng Lo ,  Mao-Jung Chen

发明人： Po-Hung Chen ,  Chin-Cheng Lo ,  Mao-Jung Chen

IPC分类号： H01L29/40

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention relates to an optical sensor chip package in a cavity of forming frame thereof and has a gap between protection layer and optical sensor chip. The optical sensor chip avoids accepting the pressure from protection layer that damage the reliability between pads and metallic traces when protection layer lay on the forming frame. It improves drawbacks of the glue pass trough the gap between optical sensor chip and pads into the optical sensor area of optical sensor chip. It improves the high process yield and reduces the height of optical sensor chip package to achieve lightly and thinly.

摘要翻译： 本发明涉及其形成框架的空腔中的光学传感器芯片封装，并且在保护层和光学传感器芯片之间具有间隙。 当保护层位于成型框架上时，光学传感器芯片避免接受来自保护层的压力，从而损坏焊盘和金属迹线之间的可靠性。 它改善了光学传感器芯片和焊盘之间的间隙的胶合通过光学传感器芯片的光学传感器区域的缺点。 它提高了高工艺成品率，降低了光学传感器芯片封装的高度，实现轻薄。