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公开(公告)号：US20250096752A1
公开(公告)日：2025-03-20
申请号：US18470091
申请日：2023-09-19
Applicant: QUALCOMM INCORPORATED
Inventor： Chirag Dipak PATEL , Chinmaya MISHRA , Cheng TAO , Muhammad HASSAN
Abstract: A radio frequency integrated circuit (RFIC), including a power amplifier (PA) connected to an antenna through a first electromagnetic (EM) element, the PA configured to receive a transmit signal from a second EM element, a low noise amplifier (LNA) connected to the first EM element and the second EM element, the power amplifier and the LNA comprising separate amplifier cores, and wherein the first EM element comprises a first plurality of interwound windings occupying a first common area and the second EM element comprises a second plurality of interwound windings occupying a second common area.
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