公开(公告)号：US20230112799A1

公开(公告)日：2023-04-13

申请号：US18047538

申请日：2022-10-18

Applicant: QUALCOMM Incorporated

Inventor： Young-Ki BAIK ,  Hyun-Mook CHO ,  Duck Hoon KIM ,  Jeong-Kyun LEE ,  Chaeseong LIM ,  Hee-Seok LEE

IPC: G06T17/10 ,  G06T7/73 ,  G05D1/02 ,  G06T7/70

Abstract: Disclosed are techniques for estimating a 3D bounding box (3DBB) from a 2D bounding box (2DBB). Conventional techniques to estimate 3DBB from 2DBB rely upon classifying target vehicles within the 2DBB. When the target vehicle is misclassified, the projected bounding box from the estimated 3DBB is inaccurate. To address such issues, it is proposed to estimate the 3DBB without relying upon classifying the target vehicle.