公开(公告)号：US11929325B2

公开(公告)日：2024-03-12

申请号：US17405860

申请日：2021-08-18

Applicant: QUALCOMM Incorporated

Inventor： Luca Mattii ,  Sidharth Rastogi ,  Ranganayakulu Konduri ,  Gerard Patrick Baldwin ,  Angelo Pinto

IPC: H01L21/00 ,  H01L23/528

CPC classification number: H01L23/5286

Abstract: Routing layers, e.g., back-end of line (BEOL) routing layers, of a semiconductor device are disclosed. Unlike conventional routing layers, the proposed routing layers include mixed pitch track patterns. As such, routing layers with reduced resistance-capacitance (RC) and low routing cost may be achieved.