公开(公告)号：US20250070001A1

公开(公告)日：2025-02-27

申请号：US18455439

申请日：2023-08-24

Applicant: QUALCOMM Incorporated

Inventor： Aniket PATIL ,  Joan Rey Villarba BUOT ,  Hi MOON

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/538 ,  H01L25/065

Abstract: A device includes a core including an upper core dielectric layer, a lower core dielectric layer, a central core dielectric layer contacting the upper core dielectric layer and the lower core dielectric layer, and a passive electronic component embedded within the central core dielectric layer. The device includes an upper laminate stack coupled to the upper core dielectric layer. The upper laminate stack includes upper metal layers and contact pads configured to electrically connect a die to the passive electronic component by way of conductive paths defined by the set of upper metal layers. The device includes a lower laminate stack coupled to a bottom surface of the lower core dielectric layer. The lower laminate stack includes lower metal layers and a set of lower dielectric layers disposed between adjacent metal layers of the set of lower metal layers.