公开(公告)号：US20240097648A1

公开(公告)日：2024-03-21

申请号：US17948984

申请日：2022-09-20

Applicant: QUALCOMM Incorporated

Inventor： Sebastian BRUNNER ,  Changhan Hobie YUN ,  Stefan Leopold HATZL ,  Manuel HOFER ,  Horst DROESCHER ,  Christian HOFFMANN

IPC: H03H9/10

CPC classification number: H03H9/1014 ,  H03H9/1071

Abstract: A package comprising an acoustic device, a polymer frame coupled to the acoustic device, a plurality of frame interconnects located in the polymer frame, where the plurality of frame interconnects are coupled to the acoustic device, a polymer cap layer coupled to the acoustic device though the polymer frame, where the polymer cap layer is configured as a cap for the acoustic device, a plurality of cap interconnects located in the polymer cap layer, where the plurality of cap interconnects are coupled to the plurality of frame interconnects, and a cavity located between the acoustic device and the polymer cap layer. The acoustic device includes a substrate and an acoustic element coupled to the substrate.