公开(公告)号：US11770149B2

公开(公告)日：2023-09-26

申请号：US17194171

申请日：2021-03-05

Applicant: QUALCOMM Incorporated

Inventor： Raymond Alexander ,  Neil Burns ,  Derek Punch ,  Norman Himaka ,  James Beckwith ,  Dave Henry ,  Joshua Britton ,  Francis Pearce ,  Michael Harrington ,  Paul Sithideth

IPC: H04M1/23 ,  H04B1/3877 ,  F16M11/04 ,  F16M13/02

CPC classification number: H04B1/3877 ,  F16M11/041 ,  F16M13/022 ,  F16M2200/066

Abstract: A mobile device holder that includes a body having a plurality of cavities. The mobile device holder includes a first assembly, a second assembly, and a third assembly. The first assembly is coupled to the body. The first assembly is configurable to be coupled to different portions of the body. The first assembly includes a first arm configured to be coupled to the body, a first slider coupled to the first arm, where the first slider is configured to move along the first arm, a first cap coupled to the first arm, and a first screw coupled to the first cap, where the first screw is configured to move the first slider along the first arm and towards the body.