公开(公告)号：US20250142319A1

公开(公告)日：2025-05-01

申请号：US18500027

申请日：2023-11-01

Applicant: QUALCOMM Incorporated

Inventor： Abhishek Pramod PATIL ,  Sai Yiu Duncan HO ,  Alfred ASTERJADHI ,  George CHERIAN ,  Gaurang NAIK ,  Naveen Kumar KAKANI ,  Niranjan REGATTE ,  Nandkishore PAI ,  Chao ZOU

IPC: H04W8/22 ,  H04L5/00

Abstract: This disclosure provides methods, components, devices, and systems for acknowledgment (ACK) processing associated with medium access control (MAC) header verification, payload verification, or both. Some aspects more specifically relate to a first wireless device advertising a processing capability associated with performing MAC protocol data unit (MPDU) verification, including MAC header verification, payload verification, or both. In some implementations, the processing capability may include a processing latency to perform the verification, a threshold quantity of MPDUs supported for the verification within a short interframe spacing (SIFS) time interval, or both. The first wireless device may transmit an indication of the processing capability to a second wireless device. In some implementations, the second wireless device may transmit MPDUs to the first wireless device in accordance with the processing capability. Additionally, or alternatively, the first wireless device may transmit an ACK frame for the MPDUs in accordance with the processing capability.